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SAMSUNG Intensifies Advanced Foundry Logic Process Development with New Semiconductor R&D Center
Seoul, Korea - November 5, 2009 : Samsung Electronics today announced that its new Semiconductor Research & Development Center has started advanced logic process development, an important part of Sams...
Seoul, Korea on Nov 05, 2009
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SAMSUNG Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Seoul, Korea - November 4, 2009 : Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die p...
Seoul, Korea on Nov 04, 2009
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SAMSUNG to Collaborate with Microsoft on Green IT Technology
Seoul, Korea - November 2, 2009 : Following a meeting in Seoul today between the Vice Chairman and CEO of Samsung Electronics Co., Ltd, Yoon-Woo Lee, and the CEO of Microsoft, Steve Ballmer, Samsung E...
Seoul, Korea on Nov 02, 2009
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SAMSUNG Electronics Develops the World's First Single Chip for North American Mobile Digital TV Standard Approved Yesterday
Seoul, Korea - October 16, 2009 : Samsung Electronics Co., Ltd., a global leader in consumer electronics, telecommunications and information technology, today announced that it has successfully develo...
Seoul, Korea on Oct 16, 2009
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SAMSUNG Introduces its First Consumer Memory Cards in Taiwan
Seoul, Korea - October 16, 2009 : Samsung Electronics Co., Ltd., the world leader in advanced semiconductor solutions, today announced that this month in Taiwan, it is introducing premium Samsung memo...
Seoul, Korea on Oct 16, 2009
