career
| area | job specification |
|---|---|
|
Device Technology Development |
Product Technology
Note PC, Monitor, LCD-TV, Mobile Display LCD Panel, Transmission Type/Reflective Type LCD Panel, High-transparent Organization, Light Recycling Organization, System Integration Technology, Device Test, Process Architecture Design Technology (Color, Driver Circuit, Light Source, CAE)TFT/CF Circuit, Backlight Design, Mechanism Design, Module Design, Color Processing, Image Processing, SMPS Power LCD Driving Circuit, Low-consumption Low-electric Power Driving Circuit Design, Timing Controller, Interface Circuit, Backlight, CCFL, EEFL, Fluorescent Lamp, LED, CNT FED B/L, Inverter, Optical Film, Device Simulation, Optical Simulation, Process Simulation, Device/Element Analysis, CAD S/W |
|
Process Development |
TFT/CF Process, LTPS Process, LC Mode/Process, Module Process, Material Development
Photo Lithography, CVD, Sputter, Wet/Clean, Dry Etching, Photo Resist, Organic Insulator, Stripper, Etchant, Electronics Material, Low Temperature Poly Silicon Cyristallization, ELA (excimer laser anneal), SLS (sequential lateral solidification), MILC (metal induced lateral crystallization) Liquid Crystal, Low Tension/High Speed Liquid Crystal Material, Liquid Crystal Mode, Alignment Layer, Rubbing, LC Alignment Adhesives, Anisotropic Conductive Film, OLB, SMT, Printed Circuit, Chip On Glass , Pb free |
|
Display Development |
Flexible Display Organic EL Technology
Organic TFT, OLED, PLED, New Display Mode, E-Ink, Evaporation, Ink Jet Printing, Roll-to-Roll Process, Low Temperature High Tension Process Technology, Encapsulation Technology |
| Optics |
Geometric Optics, Surge Optics, Thin Film
Organic TFT, OLED, PLED, New Display Mode, E-Ink, Evaporation, Ink Jet Printing, Roll-to-Roll Process, Low Temperature High Tension Process Technology, Encapsulation Technology |
| Machine Design |
Mechanism Design
Three Dimension CAD Utilization Technology Molding Technology (Injection Molding Analysis)Thermal Analysis, Impulse Analysis Reliability Test |
| Material Element |
Analysis
Three Dimension CAD Utilization Technology Molding Technology (Injection Molding Analysis)Thermal Analysis, Impulse Analysis Reliability Test Surface Analysis, Credibility Analysis, Biography Element, Chemistry Analysis |
| SW | System S/W, application S/W |
|
Production Technology |
Production Technology
Device Analysis, Device Test FAB, Process Architecture LCD Liquid Crystal, LCD Panel, Installation Estimation Mass Production TechnologyLithography, Wet Clean, CMP RTP, Diffusion, Oxidation CVD, Metalization, Ion Implation, Dry Etch Facility, Material, Instrumentation Technology, Pollution Analysis |
|
Marketing / Sales Support |
Overseas/Domestic Marketing and Sales, Procurement, Management Support (Planning, Management, Human Resources)
MBA, Business Administration, Electronics, Electronical Engineering, Industrial Engineering |
