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COB

Samsung Heats Up Indoor Lighting Market with 6W and 8W Chip-on-Board LED Packages

SEOUL, Korea – November 4, 2014 – Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package products, the LC006B and LC008B, with six and eight watts of power respectively. The new packages join five others in Samsung’s popular LC series (LC013B, LC019B, LC026B, LC033B and LC...

on Nov 04, 2014

M Series

Samsung Introduces New LED Modules for Flat Lighting Applications – the M-series

LAS VEGAS, NV – June 2, 2014 – Samsung Electronics Co., Ltd. today introduced a new line-up of LED modules called the M-series for use in flat LED lighting applications, such as troffers and linear luminaires. Samsung is showcasing the M-series at the LIGHTFAIR International trade show, being held here at the Las Vegas Convention Center tomorrow Ju...

on Jun 02, 2014

SLE-026 High CRI

Samsung Improves Color Rendering in its LED Components

LAS VEGAS, NV – May 30, 2014 – Samsung Electronics Co., Ltd. today announced that it has improved the light quality of its LED packages and modules based on a 90 CRI (Color Rendering Index) for use in advanced lighting applications. Samsung is showcasing these LED components at the LIGHTFAIR International trade show exhibition being held here from ...

on May 30, 2014

Samsung’s LED Component Test Lab Recognized by VDE Institute

SEOUL, Korea – May 20, 2014 – Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today announced that its test lab for LED component products for use in LED lighting applications was recognized by VDE Institute, the testing and certification branch of VDE Association for Electrical, Electronic & Information Technologies,...

on May 20, 2014

FCOM

Samsung Introduces Versatile New Flip Chip LED Packages and Modules

SEOUL, Korea – March 27, 2014 – Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability. The new offerings, for use in leading-edge LED lighting such as LED bulbs, MR/PAR and downlights, wi...

on Mar 27, 2014

Samsung LAM

Samsung Now Mass Producing Lens-attached Modules with Optic Technology, for Flat LED Lighting Applications

SEOUL, Korea – March 20, 2014 – Samsung Electronics Co., Ltd., a world leader in advanced component solutions and LED component technology, said today that it has begun mass producing a value-added line-up of highly efficient lens-attached LED modules (LAMs), for use in office LED lighting applications that include linear and line lighting, cove li...

on Mar 20, 2014

3432 1.4t

Samsung Introduces Several Leading-edge LED Components for Advanced Mobile Devices

SEOUL, Korea – February 18, 2014 – Samsung Electronics Co., Ltd., a world leader in advanced component solutions, introduced a range of leading-edge LED component solutions today for use in advanced mobile devices such as smartphones and tablets.Samsung’s new LEDs for mobile devices include two reflector-integrated flash LED packages ─ the 3432 1.8...

on Feb 18, 2014

LC026B

Samsung Announces Chip-on-Board LED Packages with Industry’s Highest Efficacy

SEOUL, Korea – January 29, 2014 – Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has raised the light efficacy for its chip-on-board (COB) family of LED packages to the highest in the industry. Samsung’s LC013B, LC026B and LC040B feature a compact light emitting surface (LES) with high light o...

on Jan 29, 2014

LM561B

Samsung LM561B LED Package Completes LM-80 Testing for High Lumen Maintenance

SEOUL, Korea – October 29, 2013 – Samsung Electronics Co., Ltd. announced today that the Samsung LM561B, a high-efficacy mid-power LED package has successfully completed 6,000 hours of LM-80 testing. LM-80 is a widely observed industry test for lumen maintenance developed by the Illuminating Engineering Society and leveraged by voluntary programs s...

on Oct 29, 2013

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