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2008
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Jul
Beings mass production of 1.8 and 2.5 inch multi-level cell (MLC)-based solid state drives (SSD) with 128 Gigabyte (GB) storage capacity
Jun
SAMSUNG and Sealtronic start joint production of 300 mm wafers in Singapore
Jun
Introduces high performance Smart Card IC with 90-nanometer technology for SIM cards and mobile TV applications
May
SAMSUNG develops world's fastest and largest capacity 2.5-inch, MLC-based (256GB) SSD with SATA II interface
May
SAMSUNG Electronics, Intel and TSMC reach agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012
Mar
Introduces new mobile application processor with advanced multimedia capabilities for smart phones and personal navigation devices
Feb
Develops MLC-based 128 Gigabyte, SATA II solid state drive
Jan
SAMSUNG develops MLC-based 128 Gigabyte, SATA II solid state drive
