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Jun
Samsung introduces new 45nm application processor for personal navigation devices
May
Samsung and SanDisk renew patent cross licensing and flash supply agreements
May
Launches 32-gigabyte embedded memory card produced with 3nm-clas NAND technology
Apr
IBM Technology Alliance announces availability of advanced 28nm, low-power semiconductor technology
Mar
Ships world's first and smallest high-density memory modules based on 2-gigabit (Gb), 50 nm-class DDR3
Mar
Announces use of 40nm process technology to produce eight-gigabit (Gb) Flex-OneNAND™ fusion memory chip
Feb
Announces development and Intel validation of industry’s first 40nm class DRAM chip and module
Feb
SAMSUNG forms foundry partnership to manufacture advanced programmable logic Chips for Xilinx
Jan
Developing world's highest density, four gigabit (Gb) DDR3 DRAM chip, using 50nm process technology
