Feature Phones

Mobile (or cellular) phones have become one of the most common communications devices in everyday use. Apart from simple voice calls, today's feature phones are capable of offering many other services, such as text and multimedia messaging, entertainment (playback of stored music and FM radio), and photography. feature phone

Samsung is the industry leader when it comes to supplying components for feature phones - from the most basic, entry-level instruments, to the most advanced, multi-functional handsets that are complete computers in themselves. OEMs and designers across the globe rely on Samsung for world-class devices and components, such as memory and displays, to bring their designs to market in the shortest time and at the lowest cost.

The following illustration shows the block diagram of a typical feature phone.

Block Diagram

Samsung Semiconductor Block Diagram Mobile DRAM MCP eMMC Flash Cards Display Driver IC CMOS Image Sensor SIM Card

Block Diagram shows the primary components of a feature phone - the memory subsection, the display driver ICs, the CMOS image sensor, and the SIM card IC. Samsung provides solutions for feature phones across all these device segments.

Feature phones are equipped with several types of storage memory. Examples include on-board LPDDR (Low Power DDR RAM) and slots for inserting flash cards to expand the available memory capacity. The following list provides a short overview of these memory types.

 

Mobile DRAM

Mobile DRAM is a version of the standard DRAM memory that has been redesigned specifically for use in handheld, battery-powered communication devices, such as feature phones, with the primary objective of reducing power consumption and extending the device's battery life. It is also known as Low Power DDR (LPDDR) RAM. Some the key features of Samsung mobile DRAM are very high densities, small physical footprints, ultra-low power consumption, and advanced features such as a "Standby Mode" in which power consumption of the device is completely shut off, extending the battery life of device by significant margins.

MCP

MCP, or multi-chip package, is not a type of memory, but rather a form of packaging memory chips to reduce the area they occupy and increase their available densities (per chip). An embedded device, such as a feature phone, may use a combination of several memory types, such as NAND flash, mobile SDRAM, and mobile DDR SDRAM. MCP introduces the concept of unifying multiple types of memory chips onto a single substrate, enabling the rest of the device modules to view the memory subsection as a single, unified "block". Within the substrate, the memory devices may be connected using a variety of techniques, such as die-to-die bonding or die-to-frame bonding. This technique significantly improves the performance of the device's memory subsection and reduces the board space used due to the integration of several chips onto a single substrate. Samsung has a vast portfolio of MCP products for a variety of solutions, including feature phones.

eMMC

The eMMC standard describes an architecture that consists of three components - an embedded storage solution with an MMC interface, a type of flash memory, and a controller - all integrated in a single BGA package. eMMC capable embedded memory devices contain not only a data storage element (such as NAND flash memory), but also a controller for the storage element integrated on the same silicon die. This results in several advantages, such as reduced development time and easier integration of the memory block in the overall system. Ultimately, this leads to a much shorter time-to-market for the product. Samsung is one of the main providers of eMMC technology across the world.

Flash Cards

Flash cards are a form of nonvolatile flash memory, and are used as removable storage media in devices as diverse as feature phones, digital still/video cameras, and PMPs. All latest portable computing and communication devices, such as notebook computers and feature phones, usually provide interfaces to connect flash cards. Flash Card feature is commonly provided by the device's application processor in a feature phone. Flash cards are available in various types, capacities, and form-factors. Samsung is a global leader in flash memory technology and a primary supplier of flash card-based storage solutions to several OEMs worldwide.

Display Driver IC

Since display is one of the most important output devices in a feature phone, it is vital that the performance and quality of the phone's display subsystem remain above a certain minimum threshold at all times for a good user experience. In a typical feature phone, the display driver IC (DDI) is mapped to the phone's application processor and it controls the device's LCD display. While entry-level feature phones have display resolutions as low as 128 x 160 pixels, some of the latest and most advanced handsets have displays with resolutions as high as 800 x 480 pixels.

Samsung is one of the main innovators of LCD and LED display technology (including the latest touchscreen technologies), and has been at the forefront of providing the most advanced DDI solutions for feature phones. Samsung provides DDI solutions for displays of varying resolutions.

CMOS Image Sensor

Almost all current generation feature phones are equipped with a CMOS image sensor, providing them the capability to take photographs and even record video in some cases. The CMOS image sensor acts as a "window" for the phone and converts the optical image falling on it into an equivalent electrical signal. Cameras in feature phones today use image sensors from a resolution of VGA (0.3 megapixels) to several megapixels, based on the capabilities and complexity of the phone. Samsung has a broad range of imaging solutions, including image sensors, that result in the smallest development times and costs for cameras for feature phones and smartphones.

The following are some of the key specifications of Samsung CMOS image sensors.

  • Sensor resolutions: 0.3 megapixels to 16 megapixels
  • Sensor resolutions (pixels): 648 x 488 to 4608 x 3456
  • Product type: Sensor (standalone) or Sensor plus SoC (integrated)

SIM Card

Since feature phones are battery-powered, there is great emphasis to conserve power and extend the usable duration of the phone. Dedicated circuits are present in current generation feature phones to achieve this goal.

The SIM card, used in a typical feature phone, is responsible for providing the phone with its "identity". The basic functions of the SIM are to store the IMSI and related information to identify the phone on compatible worldwide cellular networks.

Samsung has been one of the key developers of next-generation SIM card technology. The latest SIM cards introduced by Samsung have advanced features, such as high-density storage (flash), single-wire protocol (SWP) compliance, and data encryption, providing increased security of the stored data for the user. Other capabilities built into Samsung SIM cards offer important and convenient advantages to the user, such as allowing the card to be used for secure authentication.

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High Definition Multimedia Interface. CEC ensures HDMI components can be controlled by one remote
Note
  • ordering info : see below for part no. speed suffix
  • K4XXXXXXX-[Suffix]

1. temperature

2. speed for Mobile-SDRAM

3. mobile function
  • PASR : Partial Array Self Refresh
  • TCSR : Temperature Compensated Self Refresh
  • DS : Drive Strength Control

4. current
  • ICC1 @ Max.frequency, CL3
  • ICC6 @ Low, Full Bank, 85°C / 70°C
5. lead-free & halogen-free package
  • K4XXXXXXXX-XXXXX (Xth code represents a package)

  • 2 : 90FBGA (DDP)
    3 : 90FBGA (lead-free & halogen-free, DDP)
    4 : 96FBGA
    5 : 96FBGA (lead-free & halogen-free)
    7 : 90FBGA
    8 : 90FBGA (lead-free & halogen-free)
    A : 168FBGA (lead-free, halogen-free, DDP)
    F : 60FBGA (lead-free & halogen-free)
    M : 152FBGA (lead-free & halogen-free, POP)
    N : 168FBGA (lead-free & halogen-free, POP)
    P : 60FBGA (lead-free & halogen-free, DDP)
    Y : 60FBGA (DDP)