related document
quality & reliability
Backward Compatibility
As described below table, for Lead-frame type Lead(Pb)-free devices of Samsung Electronics can be integrated regardless of whether the assembly processes have already been converted to Lead-free or not. However the compatubility of BGA type devices is not fully guaranteed(soldering below 230°C is critical) since they will require a higher soldering temperature than Leaded(Pb) equivalents. The main difference between Leaded(Pb) and Leaded(Pb)-free soldering process is the temperature range : Leaded(Pb)-soldering (235°C-260°C).
Backward Compatibility
| Type | device | Compatibility | Leaded(Pb) soldering | Lead-free soldering |
|---|---|---|---|---|
| Increase temp. 20°C | ||||
| Lead frame Type | Lead(Pb)-free devices (Post plating : SnBi, Pre plating:NiPdAu) | Processability | Pass | Pass |
| Solderability | Pass | Pass | ||
| Reliability | Pass | Pass | ||
| BGA Type | Lead(Pb)-free devices (SnAgCu finishing) | Processability | Pass | Pass |
| Reliability | Pass | Pass | ||
