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quality & reliability

MSL(Moisture Sensitivity Level)

SAMSUNG's Condition & Representative Example

SAMSUNG Qualification Standard
Test Procedure
  • Component : PRE-COND & T/C, PCT (Option = HTS, THB)
  • Board : T/C (Option = THB)

Test Procedure

Reliability Test
1. PRE-COND (Pre-conditioning Test)
Process Bake -> T/C 5 time -> SOAK -> Reflow
* SOAK Condition: MIN. 30°C/60% RH 192hrs (All Package)
Reflow 3 time
* Reference Reflow Profile
Target 354/0
REF.SPEC JESD22-A113
2. Lead Free Condition IR Profile (Memory Component)
Section Temp.(°C) Time(sec) Note
Preheating 160~190 MAX 120 B
Reflow 220 MAX 60 D
Soak 255(+5, -0) MAX 11 -
Max Peak 260 - E
Ramp up / Down 1~3(°C)/sec A,C,F

Reliability Test

3. Lead Free Condition IR Profile(System LSI Component)
Process Temperature, Time Comment
Pre-Heating 160~190°C, 90±30 sec Applied to All Package
Heating 255+5, -0°C, 10±3 sec
Peak Temperature Max. 260°C
4. T/C(Temperature Cycle)
Condition Lead Type: -65°C~150°C, Ball Type: -55°C~125°C (Comp)
Lead Type: 0~125°C, Ball Type: -25°C~125°C(Module)
Read Out Time 150, 300. 600, 1000(cycle)
Target LTPD 2%, 116/0
REF.SPEC MIL 883D, 1017.7,B
5. PCT(Pressure Cooker Test)
Condition 121°C, 2atm, 100% RH
Read Out Time 96, 168, 240(hrs)
* Lead Type: 240hrs, Ball Type: 168hrs Target
Target LTPD 2%, 116/0
REF.SPEC JA102
6. THB(Temperature Humidity Bias)
Condition 85°C/85%, Bais
Read Out Time 96, 168, 300, 500, 1000(hrs)
Target LTPD 2%, 116/0
REF.SPEC JESD22-A101

note TC, PCT, THB are done after pre-condition

7. HTS(High Temperature Storage)
Condition 150°C, No Bias
Read Out Time 96, 168, 300, 500, 1000(hrs)
Target LTPD 3%, 76/0
REF.SPEC JESD22-A103
Storage & Packing Recommendation
  • It is recommended that the device should be assembled after opening the moisture barrier bag under 30°C/60% R.H. within 7 days.
  • If the humidity indicator is pink from the 30% mark or device were not assembled within 7 days after opening, the device should be baked for 6 hours at 125°C
    (Tray type) or 24 hours at 50`C (Tape&Reel type).
JEDEC / EIAJ
1. EDEC / EIAJ
Section SOAK Condition
(JSED22-A113)		 Reflow (JSTD20) Note
Level 1 85°C/85% RH 168hrs
  • PKG Thickness ≥ 2.5mm and
    ≥ 350mm3
    →245 +0/-5°C
  • PKG Thickness < 2.5mm and
    PKG VOL < 350mm3
    →250°C +0/-5°C
JEDEC
Level 1~6
Level 2 85°C/60% RH 168hrs
Level 2a 30°C/60% RH 696hrs
Level 3 30°C/60% RH 192hrs
2. EIAJ IR Condition
  • Temperature profile of infrared convection and convection reflow soldering (Condition 1-A)
  • Temperature profile of infrared convection and convection reflow soldering (Condition 1-B)

EIAJ IR Condition

Examples of Component & Board Level Reliability
Lead frame Package - Test Vehicle : 54TSOP/ 54sTSOP
1. Component Level Reliability
  • Pre-con. :Pass
  • TC 1000cycles :Pass
  • PCT 240hrs :Pass
  • HTS 1008hrs :Pass
 Level III(IR peak temp. 260°C)
(-65 ~ 150°C)
(121°C/2atm/100%RH)
(150°C)
2. Board Level Reliability
  • T/C 1000cycles :Pass
  • THB 504hrs :Pass
 (0~125°C)
(85°C, 85%, 5.0V)
CSP(Chip Scale Package) - Test Vehicle : 54WBGA
1. Component Level Reliability
  • Pre-con. :Pass
  • TC 1000cycles :Pass
  • PCT 240hrs :Pass
 (Level III : IR peak Temp. 260°C)
(-55°C ~ +125°C)
(121°C, 2 atm, 100%RH)
2. Board Level Reliability
  • TC 1000cycles : Pass
(-25 ~ +125°C)
Ball type Package - Test Vehicle : 90FBGA
1. Component Level Reliability
  • Pre-con. :Pass
  • TC 1000cycles :Pass
  • PCT 240hrs :Pass
 (Level III : IR peak Temp. 260°C)
(-55°C ~ +125°C)
(121°C, 2 atm, 100%RH)
2. Board Level Reliability
  • TC 1000cycles : Pass
(-25 ~ +125°C)