related document
quality & reliability
Solder Joint Reliability
Compatibility to the SnPb solder(Ball type)
- Lead finish: SnAgCu
- Solder paste: SnAgCu, SnPb
- Module type: Test Module
- Package: 48FBGA
- Module TC condition: -25 ~ 125°C
-
Comparison (Weibull Distribution) with 48FBGA Daisy
- SnPb/SnPb paste(x 1.0 )
- SnAgCu/SnAgCu paste(x 2.5 )
- SnAgCu/SnPb paste(x 2.3 )
Compatibility to the SnPb solder(Plastic)
- Lead finish: SnBi
- Solder paste: SnAgCu, SnPb
- Module type: R-DIMM,SODIMM, Test Module
-
Package
- 54sTSOP (Cu)
- 54TSOP (A42)
- 48TSOP - Module TC condition: 0 ~ 125°C
-
Comparison (Weibull Distribution) with 54TSOP/48TSOP Daisy
- SnPb/SnPb paste (x 1.0 )
- SnBi/SnAgCu paste (x 1.5 )
- SnBi/SnPb paste (x 0.8 )
| Finish/Solder | Module type | S/Size (pcs) |
150 cycles |
300 cycles |
600 cycles |
1000 cycles |
|---|---|---|---|---|---|---|
| SnBi/SnPb | R-DIMM(54TSOP) | 10 | - | 0 | 0 | - |
| SnBi/SnPb | SODIMM(54sTSOP) | 10 | - | 0 | 0 | 0 |
