related document
quality & reliability
Wetting Properties of the Pb-free Lead finish
The Solderability test results of SnBi (2~6%)
Dip & Look Test (Bake: 175'C, Steam Aging: 95°C, 100%RH)
Test Procedure
| PKG Type |
Bake 0h+ Aging 0h |
Bake 2h+ Aging 0h |
Bake 2h+ Aging 8h |
Judgment | Remark |
|---|---|---|---|---|---|
| A | 0/4unit | 0/6unit | 0/6unit | Good | Sn/Ag/Cu Pot, Temp. 250°C 95% Coverage |
| B | 0/4unit | 0/6unit | 0/6unit | Good |
| Condition | Results | |||||
|---|---|---|---|---|---|---|
| Bake | Steam aging |
SnPb Solder Pot(245°C) | SnAgCu Solder Pot(250°C) | |||
| After Plating | After Form | After Plating | After Form | |||
| SnBi (2~6%) |
2h | 8h | 0/5ea | 0/5ea | 0/5ea | 0/5ea |
| 4h | 16h | 0/5ea | 0/5ea | 0/5ea | 0/5ea | |
Wetting Valance
| Plating Material | SnBi | SnPb | Remark |
|---|---|---|---|
| Pot Material | SnAgCu | SnPb | |
| "0" Cross Time (sec) | 0.45 | 0.25 |
Wetting time of SnBi(2~6%) is weaker than that of SnPb but wetting force is the same level. |
| Saturation Time (sec) | 0.65 | 0.50 | |
| Wetting Force (mN) | 2.30 | 2.30 |
The comparison of Lead Pull on the each plating materials
