skip to contents

Press Center

Product Search

Part number search

Tip

Search by applications

Ordering code informatiom

Select codes

Parametric search

Period Search

All Specific

-

Category Search

IBM, Samsung and GLOBALFOUNDRIES Announce Keynote Lineup for 2012 Common Platform Technology Forum

Santa Clara, CA - February 22, 2012 : Simon Segars, president of ARM Inc., will join senior technology executives from IBM, Samsung and GLOBALFOUNDRIES as keynote presenters at the Common Platform Technology Forum, March 14, 2012 at the Santa Clara C...

SANTA CLARA, CA on Feb. 22. 2012
IBM, Samsung and GLOBALFOUNDRIES showcase next-generation chip technology

Santa Clara, CA - February 22, 2012 : IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES - forming the world´s largest chip-making consortium - will preview the future of silicon technology at the 2012 Common Platform Technology Forum to be hel...

SANTA CLARA, CA on Feb. 22. 2012
Cadence Collaborates with Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32, 28- a...

SAN JOSE, Calif., Feb. 6, 2012 - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Samsung Electronics’ Foundry business, Samsung Foundry, has collaborated with Cadence® to develop a wo...

SAN JOSE, Califonia on Feb. 6. 2012
Samsung and Cadence Announce Production of Breakthrough 32nm HD Digital Camera SoC for Ambarella

Santa Clara, CA, ARM TechCon 2011 - October 25, 2011 : Samsung Electronics Co., Ltd., a global leader in advanced semiconductor solutions and Cadence Design Systems, Inc. (NASDAQ : CDNS), a leader in global electronic design innovation, announced tod...

Santa Clara, CA, ARM TechCon on Oct. 25. 2011
GLOBALFOUNDRIES and Samsung Extend Fab Sync to New High-Performance 28nm Technology for Mobile Appli...

Milpitas, CA and Seoul, Korea - August 30, 2011 : GLOBALFOUNDRIES and Samsung Electronics, Co., Ltd. broadened their collaboration, announcing plans to synchronize global semiconductor fabrication facilities to produce chips based on a new high-perfo...

Milpitas, CA and Seoul, Korea on Aug. 30. 2011
Samsung, In Collaboration with Physical IP and Design Enablement Partners, Confirms 20nm Design Infr...

Seoul, Korea - July 12, 2011 : Samsung Electronics Co., Ltd., a global leader in advanced semiconductor solutions, today announced that its foundry business, Samsung Foundry, successfully taped-out a test chip based on its 20nm process with High-k Me...

Seoul, Korea on Jul. 12. 2011
Cadence Encounter Digital Flow Instrumental in Tapeout of Samsung 20-Nanometer Test Chip

San Jose, CA - July 11, 2011 : Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that technology leader Samsung Electronics, Co., Ltd deployed the Cadence® unified digital flow, from RTL to ...

San Jose, CA on Jul. 11. 2011
Synopsys Announces Critical Milestone in 20-nm Design Enablement Collaboration with Samsung Electron...

Mountain View, CA - July 11, 2011 : Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design and manufacturing, today announced that its design enablement collaboration with Samsung Electronics, Co., Ltd., a global le...

Mountain View, CA on Jul. 11. 2011
Samsung Qualifies 28nm LP Process Technology for High Performance Mobile Applications

San Diego, CA - June 6, 2011 : Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, today announced that its foundry business, Samsung Foundry, has qualified 28nm low-power (LP) process with High-k Metal Gate (HKMG)* t...

San Diego, CA on Jun. 6. 2011
Mentor Graphics Mine Design and Test Data to Improve IC Yield and Failure Analysis

Wilsonville, Ore. - June 3, 2011 : Mentor Graphics Corporation (Nasdaq: MENT) today described a new use model for net-based CAA and scan test diagnosis that minimizes physical failure analysis (PFA) cycle time and maximizes yield across multiple prod...

Wilsonville, Ore. on Jun. 3. 2011

1 2 3