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Green Memory in the News

Samsung's 3D V-NAND breaks Through Chip Scaling Limits

Feb. 14. 2014
Samsung's 3D V-NAND breaks Through Chip Scaling Limits      
As its migration to EUV, or extreme ultra violet lithography technology proves more challenging than expected, global chip-making industry hits a dead-end in scaling down its chip-processing technology below 10nm circuitry.

To break through the limit, chip makers are now struggling with a new groundbreaking way to fabricate transistors in a non-planar 3 dimensional structure. For example, SoC chip makers like Intel Corp. are now tinkering with a FinFET 3D transistor technology to reduce heat dissipation and current leakage that will further deteriorate as the width of the gate circuitry gets as narrow as 10nm and below.

On the other hand, NAND flash memory chip makers like Samsung Electronics and Toshiba Corp. are working on their respective 3D transistor cell structured-NAND flash memory chip technologies.

True enough, the chip-scaling technology is a measurement of how small a chip's gate circuitry, or transistor is. As semiconductor industry's mantra Moore's Law implies, if the size of the transistor is cut in half, the density and the performance of a chip double, opening the way for cuts in half in costs.

Yet, everything has its own trade-off. The downside is that heat dissipation and current leakage increases in proportion to the shrinkage of the transistor size. As electron more often swerve out of the course between a source and a drain.

NAND flash memory chips are no esception to this heat dissipation. As the width of the chip circuitry gets narrower and narrower, the interference between cells gets intensified, aggravating electron leakages.

Especially when the circuitry gets down to 10nm and below, electrons start to bump against each other, making the 10nm circuitry NAND flash memory chip almost commercially unviable.

The commercial unavailability of the 10nm circuitry NAND flash memory chip technology comes as a shock to top-tier NAND flash memory chip makers like Samsung and Toshiba.

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Source: iTers News

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