Common Platform Technology Forum 2013 Visit

Common Platform Technology Forum 2013 - Log Image

  1. Schedule : Feb. 5. 2013
  2. Location : Santa Clara, USA

Show highlights

The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. The 2013 Common Platform Technology Forum, sponsored by IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES, will showcase the latest technological advances being delivered to the world's leading electronics companies. Conference attendees can hear firsthand how the combined expertise of our partners is addressing the most demanding IC design and manufacturing challenges. Additionally, as collaborative research and innovative technology development has resulted in an accelerated roadmap and rapid customer adoption, and the conference will highlight:

- Leading-edge process technologies at 32/28-, 20-, 14-nanometer, and beyond
- Advanced innovations such as FinFet, design & technology co-optimization, and double patterning
- A peek into the future of next-generation device innovations being researched: silicon nanowires, carbon nanotubes, and 3D device structures
- A showcase of our ecosystem partners and Common Platform design, enablement, and implementation offerings in our Partner Pavilion

Samsung Speakers

- A keynote speech by Dr. KH Kim, Executive Vice President of Foundry at Samsung Electronics. Dr. Kim will discuss how Samsung Foundry innovation is accelerating access to comprehensive customer solutions at the forefront of technology, leveraging a deeper collaboration model across the entire semiconductor manufacturing ecosystem to reduce risk and speed up time-to-market for mobile components. (10:30 a.m. – 11 a.m.)
- A technical session with Dr. Shawn Han, Vice President of Foundry Marketing at Samsung Electronics, alongside Dr. Antun Domic, Senior Vice President and General Manager of the Implementation Group at Synopsys. Dr. Han and Dr. Domic will take us through a deep dive not only on the 14nm FinFET process and its technological benefits, but also detail the level of collaboration among the Common Platform Alliance, ecosystem partners and fabless companies enabling this degree of innovation. (1:30 p.m. – 2:30 p.m.)