exhibitions & forums
IIC China
show highlights
- Period : March 3. 2008 ~ March 4. 2008 (IIC China Shenzhen)
March 10. 2008 ~ March 11. 2008 (IIC China Shanghai) - Place : Shenzhen Convention & Exhibition Center @ Shenzhen
Shanghai Mart @ Shanghai - Scale : 250 exhibitors, 1,080 booths in total
- Visitor : 150,000 visitors
- Category : Consumer Electronics & Appliances, Communication Systems, Computers, Systems & Peripherals, ICs, Components, Subsystems, Controls, Security, Test, Medical Equipment, Industry Services, Automotive, Avionics, Military Electronics, etc.
general trend
IIC China continues to attract the world’s leading technology companies. Exhibitors included 12 of the Top-15 semiconductor companies, China’s local IC design houses in the expanded IC Design Pavilion, Korea’s IT-SoC in a Korean Pavilion. In Shenzhen, Components Pavilion featured high quality products from high quality components manufacturers. Product show case includes Active Components, Electromechanical Components, Electronic Production Equipment & Suppliers, Interconnects, Passive Components, and Subassemblies & Parts.
SAMSUNG product
| Memory | Digital Consumer | NAND Flash |
30nm 64Gb NAND Flash |
|---|---|---|---|
| 30nm 64Gb NAND Flash Wafer | |||
| Flash Card |
Multimedia Card (MMC) | ||
| Secure Digital (SD) | |||
| Memory Stick / M2 | |||
| Secure MMC | |||
| XD | |||
| Compact Flash Card (CFC) | |||
| SSD | 1.8" / 2.5" / Slim | ||
| Mobile | Mobile DRAM |
1.5Gb / 1GB Mobile DRAM | |
| 256Mb /128Mb UtRAM | |||
| 512Mb / 256Mb NOR Flash | |||
| MCP | 16chip MCP Wafer | ||
| 16chip / 10chip / 4chip / 3chip MCP | |||
| eMMCeMMC & moviMCP | moviMCP (eMMC Controller + 4GB eMMC + 2Gb NAND Flash + 1Gb Mobile DRAM) |
||
| 16GB / 8GB / 4GB eMMC | |||
| Micro / Mobile / Full Size Flash Card | |||
| PC & Graphic |
DRAM | 1333Mbps 1Gb DDR3 SDRAM | |
| 1333Mbps 2GByte DDR3 UDIMM | |||
| 8GByte FBDIMM | |||
| 4GByte UDIMM | |||
| 60nm 2Gb DDR2 SDRAM Wafer | |||
| 60nm 2Gb DDR2 SDRAM | |||
| Graphic DRAM |
6.0Gbps 512Mb GDDR5 | ||
| 3.2Gbps 512Mb GDDR4 | |||
| 2.5Gbps 512Mb GDDR3 | |||
| GDDR3 + GDDR4 Demo (1333Mhz 1GB DDR3 + GDDR4 Graphic Card) | |||
| Fusion Memory |
Fusion | 60nm 4Gb FlexOneNAND Wafer | |
| 60nm 4Gb FlexOneNAND (3rd Fusion Memory) | |||
| OneDRAM (2nd Fusion Memory) | |||
| OneNAND (1st Fusion Memory) | |||
| 4Gb(DDP) / 8GB(QDP) OneNAND | |||
| System LSI |
Mobile AP | PND Solution |
S3C6400 Multimedia Performance(4PIP) |
| S3C2443 stand alone CPU | |||
| S3C2443 CPU with stacked memory MCP | |||
| S3C2443 based GPS Reference Platform | |||
| Smart Phone Solution |
S3C2442 based EDGE Smart Phone Reference Platform | ||
| S3C2442 based Low-cost Smart Phone Reference Platform | |||
| S3C2442 CPU with stacked memory MCP | |||
| Mobile DDI |
Mobile DDI |
Low Power Solution for Memory Display (MIE 2.5G) | |
| 1-Chip Solution for High Resolution Mobile Display (S6FR201) | |||
| S6FR201 Wafer | |||
| S6FR201 Module (4.8" WSVGA) | |||
| Mobile TV Solution |
Mobile TV Solution |
World's First 65nm RF + Ch decoder (S3C4F60) | |
| World's First 65nm RF + Ch decoder Wafer (S3C4F60) | |||
| Cmos Image Sensor | Cmos Image Sensor | VGA-S5KA3D | |
| 1.3M-S5K6AA | |||
| 2M-S5K4BA | |||
| 3M-S5K4CA | |||
| 5M-S5K3E1 | |||
| DTV Channel Solution |
DTV Channel Solution |
DVB-T Demodulator S5H1432 | |
| ATSC Demodulator S5H1411 (VSB/QAM) |
