package information
The following package information apply to each SAMSUNG semiconductor product and to each specific product family as well.
| lead frame type | DIP | LQFP | QFP | sTSOP | SOJ | SOP |
|---|---|---|---|---|---|---|
| SSOP | TQFP | TSOP1 | TSOP2 | WSOP | ||
| area array type | BGA | BOC | FBGA | TBGA | WBGA | |
| MCP | MCP(Multi Chip Package) | |||||
| lead frame type | DIP | ELP | ELP2 | LQFP | QFP | SOP |
|---|---|---|---|---|---|---|
| SSOP | SDIP | TSSOP | TQFP | UELP | WQFP | |
| ELQFP | ETQFP | |||||
| area array type | FBGA/SIP | PBGA | TBGA | TEBGA | UGLA | WFP |
| sub assembly type | BGA | DIP | etCSP | etLGA | FBGA | HBGA |
| LBGA | LQFP | PGA | PLCC | SSOP | SOP | |
| TALGA[ULGA] | TBGA | TSSOP | QFP | QFN |
| electrical characteristics | electrical characteristics |
|---|---|
| thermal characterization | thermal characterization |
last updated on August 2006
