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K1 (UtRAM)
K4 (DRAM)
K6 (Async Fast SRAM)
K7 (Sync SRAM)
K8 (NOR Flash)
K9 (NAND Flash)
KF (OneNAND)
M3 (DIMM)
M4 (SODIMM)
MR (RIMM)
S3 (Microcontroller)
S5 (MOS)
S6 (DDI)
S8 (CDRAM)

Memory Package Data

The following package information apply to each SAMSUNG semiconductor product and to each specific product family as well.

DRAM LQFP sTSOP2 TQFP BOC FBGA LGA
WBGA          
Flash TSOP1 WSOP1 FBGA WELP LLGA TLGA
ULGA          
SRAM DIP LQFP SOP TSOP1 TSOP2 BGA
FBGA TBGA        
MCP MCP(Multi Chip Package)
last updated on November 2008
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