Memory Package Data
The following package information apply to each SAMSUNG semiconductor product and to each specific product family as well.
| DRAM | LQFP | sTSOP2 | TQFP | BOC | FBGA | LGA |
|---|---|---|---|---|---|---|
| WBGA | ||||||
| Flash | TSOP1 | WSOP1 | FBGA | WELP | LLGA | TLGA |
| ULGA | ||||||
| SRAM | DIP | LQFP | SOP | TSOP1 | TSOP2 | BGA |
| FBGA | TBGA | |||||
| MCP | MCP(Multi Chip Package) | |||||
last updated on November 2008
