Packaging
Package Families
- SAMSUNG supports the following package technologies: CSP/QFP: ELP, UELP, WLP, ULGA, LQFP/E
- High-performance BGA: FBGA, HBGA, TEBGA, FC-BGA, HFC-BGA
- High-density SIP: WB chip stack, FC chip stack, Package stack
- TCP/COG: COB, SIS module, COF, COG
SAMSUNG Packaging
3D Package Roadmap
