DRAM

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K1 (UtRAM)
K4 (DRAM)
K6 (Async Fast SRAM)
K7 (Sync SRAM)
K8 (NOR Flash)
K9 (NAND Flash)
KF (OneNAND)
KM (MOVI NAND/MCP)
M3 (DIMM)
MR (RIMM)
S3 (Microcontroller)
S5 (MOS)
S6 (DDI)
S8 (CDRAM)
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Components




DDR3+ SDRAM
part
number		 density(bit) org. bank/
interface		 refresh speed package power production
status
K4B1G0846S-HQH9 1G 128Mx8 8B/SSTL_15 8K/64ms H9 78FBGA C Mass Production
K4B1G1646E-HQH9 64Mx16 96FBGA
[note]
* For spec or simulation models, please inquire through 'Contact Us'.

1. speed
  • ordering info : see below for part no. speed suffix
  • K4BXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
H9 667MHz/1333Mbps@CL9 9-9-9

2. power
  • Q : commercial, normal (0°C ~ 95°C)

3. lead-free & halogen-free package
  • K4BXXXXXXX-XQXXX (Xth code represents a package)

    • H : FBGA (lead-free & halogen-free)


DDR3 SDRAM
part
number		 density(bit) org. bank/
interface		 refresh speed package power production
status
K4B2G0846B 2G 256Mx8 8B/SSTL_15 8K/64ms F7,F8,H9 78FBGA C,L Mass Production
K4B2G1646B 128Mx16 96FBGA
K4B1G0846E 1G 128Mx8 8B/SSTL_15 8K/64ms F7,F8,H9,K0 78FBGA C,L Mass Production
K4B1G1646E 64Mx16 96FBGA
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4BXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
F7 400MHz/800Mbps@CL6 6-6-6
F8 533MHz/1066Mbps@CL7 7-7-7
H9 667MHz/1333Mbps@CL9 9-9-9
K0 800MHz/1600Mbps@CL11 11-11-11

2. power
  • C : commercial, normal (0°C ~ 95°C)
  • L : commercial, low (0°C ~ 95°C)

3. lead-free & halogen-free package
  • K4BXXXXXXX-XXXXX (Xth code represents a package)

    • Z : FBGA (lead-free)
    H : FBGA (lead-free & halogen-free)
    M : FBGA (lead-free & halogen-free, DDP)


DDR2 SDRAM
part
number		 density(bit) org. bank/
interface		 refresh speed package power production
status
K4T1G313QI 1G 32Mx32 8B/SSTL_18 8K/64ms E7,F7,E6 128FBGA C Customer Sample
K4T1G084QE 128Mx8 F8,E7,F7,E6 60FBGA C,L Mass Production
K4T1G164QE 64Mx16 84FBGA
K4T51163QI 512M 32Mx16 4B/SSTL_18 8K/64ms F8,E7,F7,E6 84FBGA C,L Customer Sample
K4T51083QG 64Mx8 F8,E7,F7,E6 60FBGA Mass Production
K4T51163QG 32Mx16 84FBGA
K4T56163QN 256M 16Mx16 4B/SSTL_18 8K/64ms F8,E7,F7,E6 84FBGA C Customer Sample
K4T56163QI E7,F7,E6,D5,CC C,L Mass Production
K4T28163QO 128M 8Mx16 4B/SSTL_18 8K/64ms F8,E7,F7,E6 84FBGA C Customer Sample
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4TXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
CC 200MHz/400Mbps@CL3 3-3-3
D5 266MHz/533Mbps@CL4 4-4-4
E6 333MHz/667Mbps@CL5 5-5-5
E7 400MHz/800Mbps@CL5 5-5-5
F7 400MHz/800Mbps@CL6 6-6-6
F8 533MHz/1066Mbps@CL7 7-7-7

2. power
  • C : commercial, normal (0°C ~ 95°C)
  • L : commercial, low (0°C ~ 95°C)
  • Y : commercial, low voltage (0°C ~ 95°C)

3. lead-free & halogen-free package
  • K4TXXXXXXX-XXXXX (Xth code represents a package)

    • Z : FBGA (lead-free)
    H : FBGA (lead-free & halogen-free)
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DDR SDRAM
part
number		 density(bit) org. bank/
interface		 refresh speed package power production
status
K4H510438G 512M 128Mx4 4B/SSTL2 8K/64ms CC,B3,B0 66TSOP2,60FBGA C,L Engineering Sample
K4H510838G 64Mx8 CC,B3
K4H511638G 32Mx16
K4H510438F 128Mx4 CC,B3,B0 Mass Production
K4H510838F 64Mx8 CC,B3
K4H511638F 32Mx16
K4H560438J 256M 64Mx4 4B/SSTL2 8K/64ms B3,B0 66TSOP2 C,L Mass Production
K4H560838J 32Mx8 CC,B3
K4H561638J 16Mx16
K4H281638L 128M 8Mx16 4B/SSTL2 4K/64ms CD,CC 66TSOP2 C Mass Production
K4H641638N 64M 4Mx16 4B/SSTL2 4K/64ms CC 66TSOP2,60FBGA C,L Mass Production
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4HXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
B0 133MHz/266Mbps@CL2.5 2.5-3-3
B3 166MHz/333Mbps@CL2.5 2.5-3-3
CC 200MHz/400Mbps@CL3 3-3-3
CD 250MHz/500Mbps@CL3 3-4-4

2. power
  • C : commercial, normal (0°C ~ 70°C)
  • L : commercial, low (0°C ~ 70°C)

3. lead-free & halogen-free package
  • K4HXXXXXXX-XXXXX (Xth code represents a package)

    • U : TSOP2 (lead-free)
    L : TSOP2 (lead-free & halogen-free)
    V : sTSOP2 (lead-free)
    Z : FBGA (lead-free)
    H : FBGA (lead-free & halogen-free)
    F : FBGA for DDR 64Mb/128Mb (lead-free & halogen-free)


SDR SDRAM
part
number		 density(bit) organization bank/
interface		 refresh speed package power production
status
K4S560432J 256M 64Mx4 4B/LVTTL 8K/64ms 75 54TSOP2 C,L Mass Production
K4S560832J 32Mx8
K4S561632J 16Mx16 60,75
K4S280832K 128M 16Mx8 4B/LVTTL 4K/64ms 75 54TSOP2 C,L Mass Production
K4S281632K 8Mx16 50,60,75
K4S640832N 64M 8Mx8 4B/LVTTL 4K/64ms 75 54TSOP2 C,L Mass Production
K4S641632N 4Mx16 50,60,75
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4SXXXXXXX-[suffix]
part no. suffix description
50 5.0ns (200MHz@CL=3)
60 6.0ns (166MHz@CL=3)
75 7.5ns, PC133 (133MHz@CL=3)

2. power
  • C : commercial, normal (0°C ~ 70°C)
  • L : commercial, low (0°C ~ 70°C)

3. lead-free & halogen-free package
  • K4SXXXXXXX-XXXXX (Xth code represents a package)

    • V : STSOP2 (lead-free)
    U : TSOP2 (lead-free)
    L : TSOP2 (lead-free & halogen-free)


GDDR3 SDRAM
part
number		 density(bit) org. bank/
interface		 refresh speed package power production
status
K4J10324KE 1G 32Mx32 8B/SSTL_2 8K/32ms 1A,7A,08,12,14 136FBGA C Customer Sample
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4XXXXXXXX-[suffix]
part no. suffix description
1A 1.0ns (2.0Gbps)
7A 0.77ns (2.6Gbps)
08 0.8ns (2.4Gbps)
12 1.25ns (1.6Gbps)
14 1.4ns (1.4Gbps)

2. power
C : commercial, normal

3. lead-free & halogen-free package
  • K4XXXXXXXX-XXXXX (Xth code represents a package)

    • B : 136FBGA (lead-free)
    H : 136FBGA (lead-free & halogen-free)


GDDR SDRAM
part
number		 density(bit) org. bank/
interface		 refresh speed package power production
status
K4D263238K 128M 4Mx32 4B/SSTL_2 4K/32ms 40,50 100TQFP,144FBGA C Mass Production
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4XXXXXXXX-[suffix]
part no. suffix description
40 4.0ns (250MHz)
50 5.0ns (200MHz)

2. power
C : commercial, normal

3. lead-free & halogen-free package
  • K4XXXXXXXX-XXXXX (Xth code represents a package)

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