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Components




DDR3 SDRAM
part
number
density(bit) org. bank/
interface
refresh speed package power production
status
K4B2G1646B 2G 128Mx16 8B/SSTL15 8K/64ms H9 96FBGA I,P Mass Production
K4B1G1646E 1G 64Mx16 8B/SSTL15 8K/64ms H9 96FBGA I,P Mass Production
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4BXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
H9 667MHz/1333Mbps@CL9 9-9-9

2. power
  • I : industrial, normal (-40°C ~ 95°C)
  • P : industrial, low (-40°C ~ 95°C)

3. lead-free & halogen-free package
  • K4BXXXXXXX-XXXXX (Xth code represents a package)

  • Z : FBGA (lead-free)
    H : FBGA (lead-free & halogen-free)
    M : FBGA (lead-free & halogen-free, DDP)


DDR2 SDRAM
part
number
density(bit) org. bank/
interface
refresh speed package power production
status
K4T1G084QE 1G 128Mx8 8B/SSTL18 8K/64ms F8,E7,F7,E6 60FBGA I,P Mass Production
K4T1G164QE 64Mx16 84FBGA
K4T51163QI 512M 32Mx16 4B/SSTL18 8K/64ms E7,F7,E6 84FBGA I,P,D Customer Sample
K4T51163QG F8,F7,E6 Mass Production
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4TXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
E6 333MHz/667Mbps@CL5 5-5-5
E7 400MHz/800Mbps@CL5 5-5-5
F7 400MHz/800Mbps@CL6 6-6-6
F8 533MHz/1066Mbps@CL7 7-7-7

2. power
  • I : industrial, normal (-40°C ~ 95°C)
  • P : industrial, low (-40°C ~ 95°C)
  • D : industrial, super low (-40°C ~ 95°C)

3. lead-free & halogen-free package
  • K4TXXXXXXX-XXXXX (Xth code represents a package)

  • Z : FBGA (lead-free)
    H : FBGA (lead-free & halogen-free)
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DDR SDRAM
part
number
density(bit) org. bank/
interface
refresh speed package power production
status
K4H510838F 512M 64Mx8 4B/SSTL2 8K/64ms B3 66TSOP2 I,P Mass Production
K4H511638F 32Mx16 66TSOP2,60FBGA
K4H561638J 256M 16Mx16 4B/SSTL2 8K/64ms CC,B3 66TSOP2 I,P Mass Production
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4HXXXXXXX-[suffix]
part no. suffix speed CL-tRCD-tRP
B3 166MHz/333Mbps@CL2.5 2.5-3-3
CC 200MHz/400Mbps@CL3 3-3-3

2. power
  • I : industrial, normal (-40°C ~ 95°C)
  • P : industrial, low (-40°C ~ 95°C)

3. lead-free & halogen-free package
  • K4HXXXXXXX-XXXXX (Xth code represents a package)

  • U : TSOP2 (lead-free)
    L : TSOP2 (lead-free & halogen-free)
    V : sTSOP2 (lead-free)
    Z : FBGA (lead-free)
    H : FBGA (lead-free & halogen-free)
    F : FBGA for DDR 64Mb/128Mb (lead-free & halogen-free)


SDR SDRAM
part
number
density(bit) org. bank/
interface
refresh speed package power production
status
K4S561632J 256M 16Mx16 4B/LVTTL 8K/64ms 60,75 54TSOP2 I,P Mass Production
K4S281632K 128M 8Mx16 4B/LVTTL 4K/64ms 60,75 54TSOP2 I,P Mass Production
K4S641632N 64M 4Mx16 4B/LVTTL 4K/64ms 50,60,75 54TSOP2 I,P Mass Production
[note]
1. speed
  • ordering info : see below for part no. speed suffix
  • K4SXXXXXXX-[suffix]
part no. suffix description
50 5.0ns (200MHz@CL=3)
60 6.0ns (166MHz@CL=3)
75 7.5ns, PC133 (133MHz@CL=3)

2. power
I : industrial, normal (-40°C ~ 95°C), P : industrial, low (-40°C ~ 95°C)

3. lead-free & halogen-free package
  • K4SXXXXXXX-XXXXX (Xth code represents a package)

  • V : STSOP2 (lead-free)
    U : TSOP2 (lead-free)
    L : TSOP2 (lead-free & halogen-free)
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