SAMSUNG Semiconductor - Products - Fusion Memory - Flex-OneNAND™


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Flex-OneNAND™

one high density chip emerges with performance and fusion memory.

Flex-OneNAND is a monolithic integrated circuit with a NAND Flash array using a NOR Flash interface. This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in applications that would otherwise have to use more NOR components.
Flex-OneNAND enables users to configure to partition it into SLC and MLC areas in more flexible way. While MLC area of Flex-OneNAND can be used to store data that require low reliability and high density, SLC area of Flex-OneNAND to store data that need high reliability and high performance. Flex-OneNAND can let users take advantage of storing these two different types of data into one chip, which is making Flex-OneNAND more cost- and space-effective.

What is Flex-OneNAND

what is Flex-OneNAND

Benefits of Flex-OneNAND
  3-chip MCP Solution 2-chip MCP Solution
Memory
Combination
MCU - MLC NAND / NOR SLC NAND / DRAM MCU - Flex-OneNAND / DRAM
Target Application Ultra High Density Device 512MB ~ 2GB Navi. &
Music Phone, DSC
Merge Performance Comparison

Time delay of worst case during copy-back operating

worst case : Partially written two blocks are merged onto one free block

Worst Time delay of Flex-OneNAND