Fusion Memory

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SAMSUNG MCP Technology
MCP is the cost effective & general solution in mobile applications.

SAMSUNG MCP Technology

SAMSUNG announced 16 Chip MCP development (Nov. '06)
  • 2 Chip, 3 Chip, 4 Chip, 5 Chip MCP in Mass Production Now
  • New Technologies (30um Wafer Thinning, Laser Sawing and Redistributed Layer Technology) introduced for 16 Chip Stack Package
  • High density memory package solutions for Phone, MP3, memory card and DVC
  • World's First Product and 1~2 year ahead of competitors