MCP Package Information
Package Technology Roadmap
- Smaller, thinner, better performance
- Packaging technologies can overcome the limitations of Fab
- Disruptive packaging technologies enable those!
Application
- Cellular phone
- DSC/DVC
- Mobile Game Machine
- MP3, PDA
- Any Mobile Applications
Key Technology
- Chip Stack
- Double & Long Wire Bonding
- Thin wafer back grinding
- Overhang
- Optimal bonding pad arrangement
(order & location)
New Technology Introduction (TSV General)
