SAMSUNG's QFP or Quad Flat Package is an integrated circuit package with leads extending from each of the four sides. It is used primarily for surface mounting (SMD); socketing is rare, and hole mounting is not possible. There are versions having from 32 to over 300 pins with a pitch ranging from 0.4 to 1.0 mm. Special cases include LQFP (Low profile QFP) and TQFP (Thin QFP).

QFP can be provided by in-house and several outsourcing site, and quality, capacity and delivery are very safe and cost-effective.

• Quad packages have been used for years to meet increasing challenges of faster processors/controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipset, video-DAC, multi-media and other related applications. QFP applications are widely used in consumer and industrial products, automotive technology, PCs and other related products.

• Using standard technology and infrastructure
• 7x7mm to 40x40mm body size available
• Wide selection of pad size to meet die requirements
• Customized leadframe design capability
• 32~300 leads counts available
• High conductivity copper leadframes

• Excellent thermal performance with small size package because the size of die paddle can be exposed for better thermal performance.

• Excellent ground with very low impedance connection is available. Common ground can be connected to exposed pad, called by down bonding. This is promising solution for less than 0.5nH interconnection.

• Visual inspection, Open/Short test, SAT inspection
• Temperature cycling -65°C~150°C/5 cycles, Baking@125°C/24hours
• Moisture Soak : 30°C/60%RH/192 hours
• IR reflow : 220°C/3X