What is the TAB
It is the initials of Tape Automated Bonding ; one of the wireless bonding methods to connect a LSI Chip with a PCB ; the packaging technology to use the patterned tape substituting Lead Frame ; Reel to Reel Process

What is the COF
It is the initials of Tape Carrier Package and one of the methods to connect a LSI Chip with a PCB ; the packaging technology to use the patterned tape substituting Lead Frame.

• Cellular phone, PDA, LCD TV, PDP TV, Monitor, Note PC, PMP
  • - Package solution for All of Using LCD,PDP,OLED driver IC

• Using standard technology and infrastructure
• Improving Flexible efficiency
  • - Usable Flexible application
  • - Reduction in Package height
  • - Reduction in package mass
• High reliability
• Excellent fine pitch pattern

• TCP shows better thermal performance due to good thermal spreading effect through thick copper traces.

COF's unique design and process can guarantee superior reliability and as a result, it can be used in long term storage under unpacking.

• Thermal cycle : -55~125°C, 500cycles
• High Temperature storage : 150°C, 300hrs
• Pressure cooking test : 121°C/2atm/100%RH, 168hrs

• TAB(Tape Automated Bonding)
  E-TAB : Package for IC Evaluation
  B-TAB : Bend the package using slit
  BS-TAB : Bending slit for stress release
• 2-type's TAB package (COF and TCP)
  TCP (Tape Carrier Package) - 3 layer
  COF (Chip On Film) - 2 layer
• Package size
  Width : 35mm, 48mm, 70mm
  Length : Numbers of PF (one unit of PF is 4.75mm)