SAMSUNG's ELP(Exposed Leadframe Package) is a kind of Chip Scale Package using copper leadframe. ELP is mounted on a main board through metal lands perimetrically lying on the bottom surface of the package. Therefore, ELP provides the most size effective solution among the leadframe packages. Since ELP can maximize ground effect by down bonding on the exposed pad on the bottom surface of the package, it can also be a outstanding package solution for the high frequency devices. In addition, the exposed pad serves as an efficient heat path by soldering directly to the main board. Thereby ELP offers high thermal performance

• Cellular phone, PDA, LCD TV, PDP TV, Monitor, Note PC, PMP
  • - Package solution for Analog, RF, GaAs, Logic, Micro controller, DRAM, Flash devices
      - High frequency (Over 1GHz)
      - Medium power (1~2W)
      - Low to medium pin counts (up to 150pins)

• Using standard technology and infrastructure
• Improving mounting space efficiency
  • - Reduction in mounting space (Standard size : 3x3mm to 12x12mm)
  • - Reduction in mounting height (Thickness : 0.4~1.0mm)
  • - Reduction in package mass
• Low and medium ball count range : 4 to 150 balls
• Good thermal and electrical performance
• High reliability (EIAJ level 1)

• Excellent thermal performance with small size package because the size of die paddle can be exposed for better thermal performance.

• Excellent ground with very low impedance connection is available. Common ground can be connected to exposed pad, called by down bonding. This is promising solution for less than 0.5nH interconnection.

ELP's unique design and process can guarantee superior reliability and as a result, it can be used in long term storage under unpacking.

• Moisture sensitivity characterization : EIAJ level1 (85°C/85% 168hrs , IR 240°C 3 times)
• HAST : 130°C, 85% 96hrs
• Temp. cycle : -65°C ↔ 150°C, 500 cycles
• High temp. storage : 150°C, 500hrs