SAMSUNG's PBGA(Plastic Ball Grid Array) incorporate the most advanced assembly processes and design for today's and tomorrow's cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors. SAMSUNG's PBGAs are designed for low inductance, improved thermal operations adn enhanced SMT ability. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics. Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing the user flexible design parameters.

• D-TV, Graphic, MPU, DSP, Projector, Workstation, Printer
  • - Processor, graphic controller
  • - High Pin Products (200 ~ 1000balls)
  • - High power & frequency products
  • - High thermal performance - available to embedded internal heat slug (2~5W)
  • - High electrical performance w/PWR, GND plane

• Standard body size : 17.0x17.0mm to 40.0x40.0mm
• Wide ball count range : 208 to 816 balls
• Available ball pitch : 1.0mm, 1.27mm ball pitches
• Good thermal performance (2~3W)
• Reliability Level (JEDEC level 3)
• Green Products (Leadfree and halogen-free available)

• For thermal enhancement, PBGAH can be used by adding the heat slug into PBGA.
• Thermal performance of PBGA is better than that of FBGA but that is because large size die and package size.

• For power delivery enhancement, power/ground nets can employ power/ground plane with multi-layer PCB, which gives promising solution for about 0.5nH/pad.
• Differential signal line for USB, SATA, and etc can be easily implemented with managing characteristic impedance. Typically, 100Ohm differential signal line design is available over 10 Gbps.
• The dedicated custom package design is avaiable with field solving solution and circuit simulation for any special design requiring electrical performance including xtalk management, ultra-low impedance power supply network, and skew-management.

Need dry-packing during shipping

• Moisture sensitivity characterization : JEDEC level3 (30°C/60% 192hrs , IR 260°C 3 times)
• HAST : 130°C, 85% 96hrs
• Temp. cycle : -65°C ↔ 150°C, 500 cycles
• High temp. storage : 150°C, 500hrs