LGA (Land Grid Array) is a FBGA's family, but doesn't have balls. It is a kind of CSP (Chip Scale Package) using PCB Substrate. It is mounted on a main board through land without ball of bottom area and available in standard square or rectangular body size. As it has narrow ball pitch(<0.8mm) and land type without ball height, it can make a smaller size and thinner thickness than conventional PBGA and FBGA, and be use for all mobile products - Processor, analog, RF, memory. FBGA gives a cost, thin & small size and high speed benefit.

• Mobile phone, pagers, disk drive, laptop PC, DSC, camcorders, notebook, Wireless system, PDA
  • - Analog, RF, Logic, Micro controller, DRAM, Flash devices
  • - Products requiring high ball counts and small size
  • - All kinds of mobile products

• Improving mounting space efficiency
  • - Reduction in mounting space (Standard body size : 5.0x5.0mm to 19x19mm)
  • - Reduction in mounting height (Thickness : 0.6 to 1.2mm)
  • - Reduction in package mass
• Wide ball count range : 8 to 624
• Low to medium thermal performance (1~2W)
• Reliability Level (JEDEC level 3)
• Green Products (Leadfree and halogen-free available

• There is no big difference in thermal performance between FBGA and LGA if package structure is almost same.

• Power/Ground nets can be routed as short as possible, which gives promising solution for about 1nH/pad. Based on requirement, the multilayer PCB can be employed for enhancing power delivery.
• Differential signal line for USB, SATA, and etc can be easily implemented with managing characteristic impedance. Typically, 100Ohm differential signal line design is available over 10 Gbps.
• The dedicated custom package design is avaiable with field solving solution and circuit simulation for any special design requiring electrical performance including xtalk management.

Need dry-packing during shipping

• Moisture sensitivity characterization : JEDEC level3 (30°C/60% 192hrs , IR 260°C 3 times)
• HAST : 130°C, 85% 96hrs
• Temp. cycle : -65°C ↔ 150°C, 500 cycles
• High temp. storage : 150°C, 500hrs