| Surface mount type |
Quad flat package |
Leaded Type |
QFP (Quad Flat Package) |
| T(L)QFP (Thin (Low profile) Quad Flat Package) |
| ELP (Exposed Leadframe Package) |
| Area array type |
Ball Type |
HBGA (High Performance Grid Array) |
| PBGA (Plastic Ball Grid Array) |
| FBGA (Fine pitch Ball Grid Array) |
| TBGA (Tape Ball Grid Array) |
| LGA |
LGA (Land Grid Array) |
| Dual in-line package |
|
SOP (Small Outline Package) |
| TAB(Tape Automated Bonding) |
TCP (Tape Carriered Package) |
| COF (Chip on Film) |
| etc |
COG (Chip on Glass) |
| Insert type |
Dual in-line |
|
DIP (Dual In-line Package) |
| SDIP (Shrink DIP) |
