System LSI Package Data Book
Bonding Method
| Depth 1 | Depth 2 |
|---|---|
| Wire Bonding | HBGA (High Performance Grid Array) |
| PBGA (Plastic Ball Grid Array) | |
| FBGA (Fine pitch Ball Grid Array) | |
| TBGA (Tape Ball Grid Array) | |
| LGA (Land Grid Array) | |
| QFP (Quad Flat Package) | |
| T(L)QFP (Thin (Low profile) Quad Flat Package) | |
| SOP (Small Outline Package) | |
| ELP (Exposed Leadframe Package) | |
| DIP (Dual In-line Package) | |
| SDIP (Shrink DIP) | |
| Flip-Chip (Bump) | FC-CSP |
| FC-BGA | |
| TCP (Tape Carriered Package) | |
| COF (Chip on Film) | |
| COG (Chip on Glass) | |
| New Package | TSV |
| IEP | |
| RDL | WFP |
