Technical Service
Package Simulation
Electrical Simulation
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Signal Integrity Simulation
- Package-level SDN Circuit Modeling SPICE Circuit Model
S-parameter Model - Preliminary Estimation
Power/Ground Plane Model with Cavity Method
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Power Integrity Simulation
- Package-level PDN Circuit Modeling Simple Lumped Circuit Model
Detailed SPICE Circuit Model, S-parameter Model - Preliminary Estimation
Power/Ground Plane Model with Cavity Method
Thermal Simulation
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Package-Level Simulation
- Tool used : ICECHIP (Ansys) - FEM
- Considering Detail PCB Pattern
- Auto Meshing
- High Accuracy
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System-Level Simulation
- Tool used : Flotherm7.2 (Flomerics) - FVM
- Considering System-level Overall Performance
- Multi-Resolution Spatial Grid
- Handling Package, Various Set Environment
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Set-Level Thermal Management
- Co-design of Package-level and Set-level solution
- Set Environment Information Exchange is required
Mechanical Design (BLR, Warpage)
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Warpage & Coplanarity
- Warpage Prediction by Finite Element Method
- 3D Linear Thermoelastic Simulation
- Material Characterization
- Warpage Measurement using Shadow Moire
- Vertical Structure Optimization
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Board Level Temperature Cycle
- TC Life Prediction by Finite Element Method
- 3D Thermoelastic / Viscoplastic Simulation
- BLR Design Guide
- Ball Configuration Optimization
