New Technology
TSV Technology
TSV and Stacking Technology
TSV Application and Status
| Application | Target Device | Dev. Status / Production | Most Wanted | Driving Force | Key technology |
|---|---|---|---|---|---|
| Memory | FLASH, DRAM | Done / 2008~ (Via Last) 2012~ (Via First) | SSD, Flash Card/ DRAM Module | Size, Density | 12" Infra structure Via First Middle/Last KGD (Known-Good Die) |
| Analog, CIS | Analog, CIS | Done / 2008~ (8") | Analog Application CIS Module | Size, Yield | 8" Infra. Structure Via Last Test, Lens & Module technology (CIS) |
| Ext.- Memory's I/O Bus Extension | GPU/MPU, Mobile CPU | Develop / 2012~ | Graphic Card PC, Works, Server Mobile phone | Performance, Cost | 12" infrastructure Via Middle/First Design (Process) Rule, EDA Infra. / Methodology (Electrical/Thermal/ Mechanical) Memory KGD/Test (BIST) |
| Replacing L2 Cache | |||||
| Logic Die Partitioning | CPU, FPGA, ASOP | Plan / 2015~ | 32nm ~ | Performance, Cost |
