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K1 (UtRAM)
K4 (DRAM)
K6 (Async Fast SRAM)
K7 (Sync SRAM)
K8 (NOR Flash)
K9 (NAND Flash)
KF (OneNAND)
KM (MOVI NAND/MCP)
M3 (DIMM)
MR (RIMM)
S3 (Microcontroller)
S5 (MOS)
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Eco product

Marking Information

Memory Component

component
Contents of Marking
  • (1) SAMSUNG logo : SAMSUNG or SEC
    top matking type mark criteria package
    SAMSUNG marking 11.2mm(>)(over)
    (Mark able width)     		TSOP2, TSOP1, QFP, U-BGA, W-BGA, TBGA, FBGA, BOC, FCFBGA, DSP, LGA etc
    SEC marking 11.2mm(<=)(under)
    (Mark able width)     		54sTSOP, U-BGA, W-BGA, TBGA, FBGA, BOC etc
  • (2) Year & Week
  • (3) Part Number : Refer to Part No. decoder page
  • (4) Lot Number