Overview

Drawing file download : Samsung Semiconductor PDF

DRAM is used in virtually every general-purpose and industrial computing device, such as desktops, laptops, servers, workstation computers, camcorders, digital cameras, and as buffer memory in many other digital devices. Several other applications, such as gaming consoles, also use DRAM as their main memory.

Samsung is the world's top manufacturer of all types of DRAM memory, such as SDRAM, DDR DRAM, DDR2 DRAM, and DDR3 DRAM, among others. Apart from the consumer segment, Samsung has an extensive portfolio of DRAM solutions for the industrial segment, with specialized designs that feature outstanding quality and reliability, along with the lowest power consumption at the fastest speed.

Packaging DRAM Memory

DRAM memory operates from several hundred MHz to several GHz, based on the deployed application. Due to the specific speed requirements, advanced technologies must be applied to the memory's packaging design to improve the performance of DRAM devices, and reduce stray parasitic capacitances and lead inductances. Currently, the most commonly used packages for DRAM memory are Wire-bonding type BGA (Ball-Grid Array).

Figure 1 illustrates a cross-sectional view of a typical DRAM module encapsulated in a BGA package.

The illustration above highlights Flip Chip Technology, the most advanced technique for packaging DRAM, and other similar, high-speed memory modules.

The Flip Chip technique consists of placing metal bumps on top of pads placed on the surface of the integrated circuit chips. The wafer is then cut into individual chips and flipped over (hence the name "Flip Chip”) so that the metal bumps face down and are aligned with the pads of the substrate. The final phase - bonding the device to the circuit board - is then completed using one of several techniques (such as using a reflow process).

Flip Chip is the most advanced packaging technique for DRAM memory, owing to several advantages it offers over other techniques, such as maximizing the throughput of the packaging processes, reducing the lead inductance of the device to the minimum extent (due to the use of metal bumps), minimizing its power consumption, and enhancing noise rejection at higher frequencies.

Samsung has the most refined processes in the world for packaging DRAM memory. Samsung's advanced Flip Chip processing and packaging techniques ensure DRAM memory of the highest quality, optimized for operating at the highest frequencies, and consuming the lowest power. Furthermore, Samsung's production techniques assure maximum output in terms of the number of working chips per processed wafer.

Key Features and Benefits of Samsung's DRAM Packaging Techniques

Samsung's advanced and specialized processing and packaging techniques for DRAM memory provide several important benefits to the end application. Some of the most significant features and benefits are listed below:

Application Areas for Samsung's DRAM Packages

Samsung's DRAM packaging techniques are the industry-standards and benchmarks for memory devices. Today's highly demanding applications require the highest throughputs from the deployed memory, and Samsung's packaging techniques ensure that memory does not become a performance bottleneck in such applications.

Some of the application areas for Samsung's Flip Chip DRAM package include: