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Drawing file download : Samsung Semiconductor PDF

An image sensor package is one of the most important components of any digital imaging device. It is a combination of an image sensor (such as a Charge Coupled Device or active-pixel sensor) mounted on an LGA (Land Grid Array) printed circuit board, held in place by a plastic holder, and covered by double-sided antireflective glass. This document describes the techniques for packaging such imaging devices, widely used in digital still/video cameras, digital camcorders, mobile cameras, and security cameras.

Packaging Techniques for Imaging Devices

As the imaging sensor is one of the principal components in any imaging or photography device, sufficient attention must be paid to its packaging, to ensure high-performance and reliable operation of the end application. Figure 1 illustrates how a typical image sensor is packaged, before it is deployed within the application.

Samsung Semiconductor Package Information

The complete imaging package is composed of the following elements:

  • mage sensor :
    Considered the heart of any imaging device, the image sensor captures incoming light, and converts it to electrical signals. These signals are processed further to obtain a pattern for the image falling on the sensor.
  • Copper-based LGA PCB :
    The LGA (Land Grid Array) package is one of the most preferred packages for deployment in small, handheld, and space-constrained applications. The LGA package is a version of the standard BGA package with no spheres (solder balls). The image sensor is mounted on the LGA PCB, providing the shortest interconnecting signal paths out of the sensor.
  • Plastic holder :
    The plastic holder provides a "frame” to hold the image sensor assembly in place.
  • Double-sided antireflective glass :
    The package is covered on top with double-sided antireflective glass to reduce reflection and improve image contrast.

Samsung's advanced fabrication, processing, and packaging techniques for imaging sensors ensure that the sensors have excellent characteristics, such as low noise, high sensitivity, high resolution, wide spectral response, and high quantum efficiency (QE). Additionally, Samsung imaging device packages have exceptional thermal reliability.

Key Features and Benefits of Samsung's Packaging Techniques for Imaging Devices

Samsung's advanced packaging techniques for imaging devices provide the imaging sensors with some of the most distinct features, as listed below:

  • Ultra-low form-factors:
    Samsung provides imaging sensors with the smallest form-factors for deployment in the most compact applications, such as today's high-end digital cameras and camcorders. For example, Samsung imaging device packages for digital still and video cameras are just 10 mm x 10 mm, while those for digital single-lens reflex (DSLR) cameras are about 38 mm x 28 mm in size.
  • High thermal and transmission efficiencies:
    Samsung imaging sensor packages have high thermal stability, enabling the devices to be operated over wider temperature ranges, and in environments with frequent and wide temperature swings.
  • Available in industry-standard PLCC packages:
    Samsung imaging devices are available in industry-standard PLCC (Plastic Leaded Chip Carrier) packages, enabling them to be deployed easily in new products, reducing their time-to-market.
  • Very high thermal stability and operational reliability:
    Samsung's advanced processes for packaging of imaging devices ensure consistent and reliable operation for the devices under extreme temperature conditions. Some of the distinct reliability related statistics for Samsung's unique processes are as follows:
    • Moisture sensitivity: JEDEC Level 4 (30°C/60%, 96 hours, IR 185°C (DSLR), ~260°C (DSC), 3 times)
    • WHTS test: 85°C, 85% relative humidity, 500 hours
    • Boundary temperature cycles: 200 cycles (-55~125°C)
    • High temperature storage test: 500 hours (125°C)

Areas that can Benefit from Samsung's Packaging Techniques for Imaging Devices

As stated previously, imaging devices are used in a wide range of professional, medical, and scientific applications. Some of the principal areas that stand to benefit from using Samsung's advanced packaging techniques for imaging devices include:

  • Digital photography equipment:
    Devices such as digital still and video cameras stand to benefit significantly from using Samsung's high-end imaging sensors packaged using the most advanced packaging techniques available. Additionally, professional cameras, such as digital single-lens reflex (DSLR) cameras also stand to gain substantially from switching to Samsung's imaging devices. Samsung's imaging devices solutions range from variants below 1 MP, to sensors with resolutions as high as 16  MPs.
  • Mobile photography:
    Mobile cameras, along with webcams, most commonly use the active-pixel type of image sensors. Samsung is a leading provider of imaging solutions in this segment, and has a wide range of imaging devices to cater to the mobile telephony market.
  • Security photography:
    Samsung has a wide range of imaging devices for the security segment, including devices designed for deployment in infrared cameras.