Mounting Method

Mounting Method
Depth1 Depth2 Depth3 Depth4
Surface mount type Quad flat package Leaded Type QFP (Quad Flat Package)
T(L)QFP(Thin(Low profile) Quad Flat Package)
ELP (Exposed Leadframe Package)
Area Array Type Ball Type PBGA (Plastic Ball Grid Array)
FBGA (Fine pitch Ball Grid Array)
LGA LGA (Land Grid Array)
Wafer Array Type Fan-in WLP(Wafer Level Package)
Fan-out WLP(Wafer Level Package)
Dual in-line package SOP(Small Grid Array)
TAB
(Tape Automated Bonding)
TCP (Tape Carriered Package)
COF (Chip on Film)
etc COG(Chip on Glass)
Insert type Dual in-line DIP(Dual In-line Package)
SDIP(Shrink DIP)