Space efficiency unlocks new levels of design freedom.
The big challenge for smartphone manufacturers is maximizing efficient use of board space, and this requires the smallest form factor components. Samsung proposed a solution by stacking mobile DRAM on top of eMMC, delivering smaller footprint that satisfies the requirements of mobile devices today.
Through stacking, Samsung developed a MCP that is extremely thin (less than 1 mm), and also reduced the required board space. By combining two key elements into a single package, Samsung MCP helps device makers to reduce the total space requirement for memory by 30-40 percent.