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      • All-in-one solution  for the ultra small.

        ePoPAll-in-one solution
        for the ultra mini.

        A revolutionary breakthrough single-package of eMCP and AP that uses minimal space in a wide range of wearable devices.

      ePoP (embedded Package on Package)

      The three best mobile technologies in one package.

      Samsung has solved the dilemma of wearables that must be sleek in design and enjoy long unplugged life.
      The industry’s first ePoP combines the advanced and power-efficient mobile DRAM, eMMC and Application Processor in a single package,
      achieving extreme compactness for wearable devices.
      Maximizing space efficiency through the smallest footprint.
      Maximizing space efficiency through the smallest footprint.
      Samsung ePoP(embedded Package on Package) exploits extreme space utilization to enable small and light wearables that still deliver impressive performance. This also releases critical design space for other functions on the wearable.

      Samsung ePoP saves around 60% of space by stacking components over one another, compared to using each component separately. ePoP only occupies the same space as a mobile AP with a thickness as thin as 1.4mm.
      Enabling power efficient wearables.
      Enabling power efficient wearables.
      ePoP is comprised of AP, eMMC and mobile DRAM, each of which are uniquely and impressively power-effecient. Combined in one package, ePoP creates synergy between the three combined components, and this lets your wearable device perform higher with lower battery power, delivering even higher energy efficiency.

      LPDDR3 has 10% improved power efficiency over LPDDR2. Also, eMMC consumes unprecedentedly low power of 0.5 watts, which is 80% lower than the lowest power-consuming SSD.
      Creating more possibility with heat-resistant package.
      Creating more possibility with heat-resistant package.
      Normally, NAND flash is sensitive to heat and thus cannot be stacked on high-temperature components such as application processors.

      However, Samsung ePoP is crafted with special heat resistant properties to overcome this obstacle. Today, mobile DRAM and eMMC can be stacked directly on top of the application processor without taking up any additional space, providing the perfect package for compact wearable devices.

      Related Resources

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          22 Mar, 2016
        • Solution Brief for Wearable
          Let Samsung’s technology deliver a hands-free digital life with 24/7 availability.
          27 Mar, 2016

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