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Product Package

Here you’ll find tools and utilities for developing your products and more specific technical support information.

PACKAGE LIST

  • DRAM

    DRAM

    Overview

    DRAM is used in virtually every general-purpose and industrial computing device, such as desktops, laptops, servers, workstation computers, camcorders, digital cameras, and as buffer memory in many other digital devices. Several other applications, such as gaming consoles, also use DRAM as their main memory.

    Samsung is the world's top manufacturer of all types of DRAM memory, such as SDRAM, DDR DRAM, DDR2 DRAM, and DDR3 DRAM, among others. Apart from the consumer segment, Samsung has an extensive portfolio of DRAM solutions for the industrial segment, with specialized designs that feature outstanding quality and reliability, along with the lowest power consumption at the fastest speed.

    Packaging DRAM Memory

    DRAM memory operates from several hundred MHz to several GHz, based on the deployed application. Due to the specific speed requirements, advanced technologies must be applied to the memory's packaging design to improve the performance of DRAM devices, and reduce stray parasitic capacitances and lead inductances. Currently, the most commonly used packages for DRAM memory are Wire-bonding type BGA (Ball-Grid Array).

    FCFBGA 1chip
    WLI DDP

    The illustration above highlights Flip Chip Technology, the most advanced technique for packaging DRAM, and other similar, high-speed memory modules.

    The Flip Chip technique consists of placing metal bumps on top of pads placed on the surface of the integrated circuit chips. The wafer is then cut into individual chips and flipped over (hence the name "Flip Chipâ) so that the metal bumps face down and are aligned with the pads of the substrate. The final phase - bonding the device to the circuit board - is then completed using one of several techniques (such as using a reflow process).

    Flip Chip is the most advanced packaging technique for DRAM memory, owing to several advantages it offers over other techniques, such as maximizing the throughput of the packaging processes, reducing the lead inductance of the device to the minimum extent (due to the use of metal bumps), minimizing its power consumption, and enhancing noise rejection at higher frequencies.

    Samsung has the most refined processes in the world for packaging DRAM memory. Samsung's advanced Flip Chip processing and packaging techniques ensure DRAM memory of the highest quality, optimized for operating at the highest frequencies, and consuming the lowest power. Furthermore, Samsung's production techniques assure maximum output in terms of the number of working chips per processed wafer.

    WLI QDP

    Figure 2 illustrates an LPDDR2 mobile DRAM memory in an FBGA package.

    Samsung's FBGA packaging uses the industry's best PCB substrates to achieve the chip scale packaging levels needed for small form factor mobile DRAM devices. The reduced outline and thickness offered by the package, coupled with its high density make it an ideal option for portable, high performance applications. FBGA packages offer the additional flexibility of letting the designer select the ball pitch, so that more I/O lines can be accommodated within the same form factor device.

    Key Features and Benefits of Samsung's Packaging Technology for Application Processors

    Samsung's advanced processing and packaging technology ensures that the application processors have some of the most distinct features, as listed below:

    • Low footprints and thinnest profiles :

      Samsung's specialized processes encapsulate application processors in the smallest packages, achieving significant reductions in their physical sizes. This, in turn, reduces the board space occupied by the device in the final application. The process also ensures that the package profile (or height) is kept to as low a value as possible, making it easier to use the processor in compact, space-constrained applications such as digital still/video cameras and mobile handsets.

    • High-speed device compliant :

      High-end embedded computing devices, such as network processors, usually contain more than 1 computing core per device (typically 3 to 4 cores per processor). Samsung's packaging technology is well suited for such high-speed, multi-core application processors, which involve extensive on-chip interconnection between the cores.

    • High-density I/O capable :

      Application processors usually contain a large number of I/O lines, resulting in the pin counts for the device reaching significantly high numbers (as high as 1,000 in certain cases). Using industry-standard alternative versions of the BGA package, such as FPBGA (Fine-Pitch Ball Grid Array), Samsung's refined processing techniques ensure reliability for all I/O lines on the chip.

    • Excellent thermal stability and operational reliability :

      Samsung's packaging technology provides high heat-dissipation capabilities for the device, eliminating the necessity for additional heat-dissipation mechanisms, such as heat sinks for the devices. Additionally, the techniques provide significant.

    Areas that can Benefit from Samsung's Packaging Technology for Application Processors

    Samsung's advanced processing and packaging technology ensures that the application processors have some of the most distinct features, as listed below:

    • Mobile computing devices :

      Application processors are used in all mobile computers, such as tablets, PDAs, and ebook readers. Samsung's advanced processing and packaging technology for application processors can be used to improve and enhance the capabilities and performance of such applications.

    • Mobile communications devices :

      Application processors are used in all mobile computers, such as tablets, PDAs, and ebook readers. Samsung's advanced processing and packaging technology for application processors can be used to improve and enhance the capabilities and performance of such applications.

    • Entertainment/gaming devices :

      Today's high-end gaming devices require significant computing power, and most commonly use multi-core processors. Such applications stand to gain considerably by using Samsung's packaging technology for their multi-core application processors.

    • Consumer products :

      Product-specific application processors are used in a wide range of consumer electronic products, such as digital TVs and set-top boxes, DVD/Blu-ray players, and automobile navigation systems. The performance of such devices can be improved manifold by adopting Samsung's industry-leading packaging technology for application processors.

  • FLASH

    FLASH

    Overview

    Flash is used in virtually every general-purpose and industrial computing device, such as desktops, laptops, servers, workstation computers, camcorders, digital cameras, and as buffer memory in many other digital devices. Several other applications, such as gaming consoles, also use DRAM as their main memory.

    Packaging Technology for Flash Memory

    Flash memory packages are commercially available in several package types, such as TSOP (Thin Small Outline Package),, and FBGA (Fine-pitch Ball Grid Array), among others. The end application's reading and writing speed, the available footprint, and required densityare the primary dictators of the type of packages selected for deployment.

    Internally, the die stack design for the flash memorystack is critical factors to determine the packaging yield, its reliability of products, and its form factor. Figure 1 below illustrates the internal layout of a flash memory die stack structures in a standard BGA package.

    FBGA HDP
    FBGA QDP

    As the illustration shows, this package "stacks” several memory dies to achieve the desired storage capacity for the compete chip. The immediate advantage of this approach is a significant saving in the total area occupied by the memory device. The die stack design is thus extensively used in flash memory for applications where space is severely restricted, such as mobile handsets, SSDs, and memory cards, among others.

    Samsung's advanced processing and packaging techniques for the die stack design ensure that the flash memory devices are optimized for the highest levels of speed and data throughputs, the smallest footprint, and the lowest power consumption. Samsung is an industry-leader in the flash memory segment and has developed memory with up to 16 die stacks on a single package, using the optimized stacking technologies.

    The leading-edge high-level die stacking technology is resulting in faster and higher capacity nonvolatile storage devices, such as solid state drives. Additionally, this technology promises to significantly increase the amount of data storage capacities in newer generation computing and communication devices, such as mobile handsets, and portable media players.

    Key Features and Benefits of Samsung's Packaging Techniques for Flash Memory

    Samsung's advanced packaging techniques for flash memory provide the resulting devices with some of the most distinct features, as listed below:

    • Ultra-high memory densities:

      Samsung is the world's largest memory supplier and Samsung flash memory is the highest density flash memory across the electronics and semiconductor segment. As an example, Samsung supplies 128 GB flash memory devices internally organized as 16-stack MCP flash memory, with 64 Gb per die.

    • Multi-channel I/O capability:

      High-end embedded computing devices, such as network processors, usually contain more than 1 computing core per device (typically 3 to 4 cores per processor). Samsung's packaging technology is well suited for such high-speed, multi-core application processors, which involve extensive on-chip interconnection between the cores.

    • Lowest footprints and thinnest profiles:

      Application processors usually contain a large number of I/O lines, resulting in the pin counts for the device reaching significantly high numbers (as high as 1,000 in certain cases). Using industry-standard alternative versions of the BGA package, such as FPBGA (Fine-Pitch Ball Grid Array), Samsung's refined processing techniques ensure reliability for all I/O lines on the chip.

    • Very high thermal stability and operational reliability:

      Samsung's advanced processes for packaging all types of flash memory ensure that the device operates consistently and reliably under extreme temperature conditions.

    • Available in halogen-free composition:

      Samsung's production processes are optimized to use environmentally-friendly constituents. Samsung flash memory products are also available in a halogen-free composition to comply with globally defined standards for halogen-free electronic devices and components.

    Areas that can Benefit from Samsung's Packaging Techniques for Flash Memory

    Flash memory is used in a host of consumer, industrial, and automotive electronics, and Samsung's advanced packaging techniques provide flash memory a multitude of benefits, such as smaller sizes, increasing densities, and lower power consumption levels.

    Some of the principal areas that stand to benefit from using Samsung's packaging techniques for flash memory include:

    • Computing devices:

      Desktop PCs, notebooks, and servers are gradually switching from HDDs to flash memory-based SSDs for data storage, due to the latter's reliability and lower power consumption. Advances in flash memory technologies have now made available SSDs that equal (or rival) the storage capacities of HDDs.

    • As buffer memories in hybrid drives:

      A hybrid drive integrates some amount of flash memory onboard a conventional HDD, with the flash memory acting as a "buffer" to reduce data access times. Such drives are usually referred to as "hybrid SSDs” and offer better performance than conventional HDDs.

    • As removable storage media:

      Flash memory is widely used as portable storage media, in devices such as USB drives. With higher levels of integration and increasing densities of flash memory, higher capacity, flash-based external HDDs are also available. Flash memory is also available for devices such as smartphones, tablet computers, and PMPs, as flash cards - a form of removable storage media.

  • MOBILE MEMORY

    MOBILE MEMORY

    Overview

    Mobile DRAM, or Low Power DDR (LPDDR/LPDDR2) RAM, is a version of the standard DRAM memory designed specifically for use in handheld, battery-powered computing and communication devices, such as mobile phones and PDAs. This document describes the most common packaging techniques for mobile DRAM, where the key features are having the smallest form factors and lowest power consumption.

    Packaging Technology for Flash Memory

    Mobile DRAM devices most commonly use FBGA (Fine-pitch Ball Grid Array) packages, which have several advantages, such as a thin and light structure, low profile (height), configurable ball pitch, and suitability for production of all types of devices on the mobile platform, such as processors, memory, and RF transceivers.

    Because of extreme space constraints in the latest mobile devices, mobile DRAM is most commonly packaged using the PoP (package on package) technology, allowing board space to be used more efficiently. Furthermore, the PoP package also lends itself to easy installation on an SoC (system on a chip) package, forming a MCP (multi chip package) solution containing both the processor and memory on top of one another.

    Figure 1 illustrates a cross-sectional view of a typical mobile DRAM encapsulated in an FBGA package.

    FBGA 2chip
    QDP cross1

    Housed in either a square or rectangular body, FBGA packages for mobile DRAM are a type of CSP (chip scale package), which means that the size of the package is almost the same as the size of the chip inside the package.
    FBGA packages also possess another important advantage: a significantly low mass, resulting in a low weight for the package. For FBGA packages, the ball pitch is also easily configurable from values as low as 0.40 mm to as high as 1.00 mm. Advanced processing and fabrication technologies available today enable a single FBGA package to have anywhere between 8, to more than 600 balls.

    DDP same

    Figure 2 illustrates an LPDDR2 mobile DRAM memory in an FBGA package.

    Samsung's FBGA packaging uses the industry's best PCB substrates to achieve the chip scale packaging levels needed for small form factor mobile DRAM devices. The reduced outline and thickness offered by the package, coupled with its high density make it an ideal option for portable, high performance applications. FBGA packages offer the additional flexibility of letting the designer select the ball pitch, so that more I/O lines can be accommodated within the same form factor device.

    Key Features and Benefits of Samsung's Packaging Techniques

    Samsung has the industry's most advanced processing and packaging techniques for mobile DRAM. Some of the significant features of these techniques are listed below:

    • Available in both discrete and PoP type packages:

      Samsung mobile DRAM packaging techniques encompass the best quality packaging in both the discrete and PoP types. The advantage of a discrete package is a very low profile for the package, whereas the advantage of a PoP package is a higher level of integration, higher memory density, and an efficient utilization of the available board area.

    • Ultra-low form factors:

      Samsung mobile DRAM packages have very small form factors, enabling their deployment even in the most advanced and compact devices where board space is extremely limited. Available packages range in size from as small as 8.0 mm x 9.0 mm, to about 16 mm x 16 mm, providing efficient utilization of board space. Moreover, package profiles range from 0.8 mm, to about 1.4 mm, with significantly low masses, helping keep the weight of the end application as low as possible.

    • Wide ball counts with configurable ball pitches:

      Samsung mobile DRAM packages offer easily configurable ball pitches, from 0.40 mm, to 1.00 mm. Because of this ease of configurability, ball counts can be taken to values as high as 600 in a single FBGA package.

    • High memory density:

      Samsung's advanced processing techniques ensure that a PoP design for a mobile DRAM module can accommodate up to 4 dies per stack, significantly increasing the density for the chip.

    • Stable and dependable thermal performance:

      Mobile DRAM memory packaged using Samsung's advanced packaging techniques demonstrate excellent thermal stability, preventing conditions such as thermal runaways, and are capable of handling powers up to 2 W.

    • Superior electrical performance:

      Samsung's advanced routing techniques for mobile DRAM ensure that power and ground nets are routed over as short a distance as possible. This makes it easy for packages to deploy multiple layers for power and ground management. Additionally, it also makes it easy to deploy differential signaling using separate layers, with controlled characteristic impedances, making it possible to simplify connectivity for interfaces such as USB and SATA which use differential signaling.

    • Available in lead- and halogen-free variants:

      Samsung's mobile DRAM packaging techniques use the latest, lead- and halogen-free manufacturing processes, making the material for the devices environmentally-friendly, and easier to recycle and reuse.

    Application Areas for Samsung Mobile Memory Packages

    Samsung's packaging techniques for mobile DRAM are the industry-standards and benchmarks for packaging mobile memory devices. Memory packaged using Samsung's advanced processing techniques are deployed across a wide spectrum of applications, some of which are listed below:

    • Mobile communication devices:

      Because of their critical space, weight, and power conservation requirements, mobile handsets are the principal beneficiaries of Samsung's advanced mobile DRAM packaging solutions.

    • Handheld computing devices, such as tablet computers, and PDAs:

      Battery-powered, handheld computing devices that need sufficient performance from the memory subsystem at reduced power consumption levels, also stand to gain from Samsung's packaging solutions for mobile DRAM.

    • Digital still/video cameras:

      Imaging devices, such as digital still/video cameras also require a high performance memory subsystem. Samsung's advanced manufacturing and processing techniques provide both performance as well as low power consumption, offering extended durations of usage for these devices.

    • Consumer products:

      Consumer electronic products, such as digital TVs, Blu-ray players, and automobile navigation systems can greatly benefit from Samsung's highly advanced packaging solutions for mobile DRAM, which provides the highest memory densities and ball counts within the smallest package sizes.

    • Analog, digital, and mixed-signal processors and chipsets:

      Mobile DRAM packaging technology from Samsung is deployed extensively in analog, digital, and mixed-signal processors, such as front-end RF chipsets for wireless transceivers, programmable logic devices (FPGAs and CPLDs), application processors, and other devices requiring high densities of memory on the chip.

  • APPLICATION PROCESSOR

    APPLICATION PROCESSOR

    Overview

    An application processor, or SoC (System on a Chip), is a microprocessor with a specialized architecture for deployment in embedded systems, such as digital still/video cameras, digital/smart TVs and set-top boxes, and automotive systems, among others. This document describes the specific packaging technology needed for application processors to enable them to achieve the required performance at low power consumption levels with limited board space.

    Packaging Technology for Application Processors

    An application processor is a highly specialized and complex device operating at frequencies of several hundred MHz, to a few GHz, and hence, careful attention must be paid to the design of its packaging. Leading-edge, high-performance application processors, such as Samsung's Exynos 4210, are packaged using the Package on Package (PoP) technology, resulting in significant savings in board space in the final design.

    Figure 1 below illustrates a DRAM memory package stacked on top of an application processor, used in a typical PoP design. The figure also shows extended details for the package, such as the interconnecting wires, metal bumps, and the stacking balls that connect the separated packages.

    FCFBGH
    PoP 2chipstack
    TSVSiP DDP
    TSVSiP QDP

    Samsung's advanced processing and packaging technology ensure that PoP devices, such as application processors, as well as high-density memory chips, are optimized for the highest levels of performance, and the lowest power consumption. The PoP technique offers significant benefits, particularly for packaging application processors, since the logic layer at the bottom and the memory layer at the top can be selected, assembled, and tested independently.

    Application processors packaged using Samsung's advanced PoP technologies have ultra-low physical footprints (as low as 12 mm x 12 mm, to 14 mm x 14 mm), and result in devices with the thinnest profiles, making them ideal for deployment in space-constrained applications, such as mobile handsets and portable media players.

    Key Features and Benefits of Samsung's Packaging Technology for Application Processors

    Samsung's advanced processing and packaging technology ensures that the application processors have some of the most distinct features, as listed below:

    • low footprints and thinnest profiles :

      Samsung's specialized processes encapsulate application processors in the smallest packages, achieving significant reductions in their physical sizes. This, in turn, reduces the board space occupied by the device in the final application. The process also ensures that the package profile (or height) is kept to as low a value as possible, making it easier to use the processor in compact, space-constrained applications such as digital still/video cameras and mobile handsets.

    • High-speed device compliant :

      High-end embedded computing devices, such as network processors, usually contain more than 1 computing core per device (typically 3 to 4 cores per processor). Samsung's packaging technology is well suited for such high-speed, multi-core application processors, which involve extensive on-chip interconnection between the cores.

    • High-density I/O capable :

      Application processors usually contain a large number of I/O lines, resulting in the pin counts for the device reaching significantly high numbers (as high as 1,000 in certain cases). Using industry-standard alternative versions of the BGA package, such as FPBGA (Fine-Pitch Ball Grid Array), Samsung's refined processing techniques ensure reliability for all I/O lines on the chip.

    • Excellent thermal stability and operational reliability :

      Samsung's packaging technology provides high heat-dissipation capabilities for the device, eliminating the necessity for additional heat-dissipation mechanisms, such as heat sinks for the devices. Additionally, the techniques provide significant

    Areas that can Benefit from Samsung's Packaging Technology for Application Processors

    Samsung's advanced processing and packaging technology ensures that the application processors have some of the most distinct features, as listed below:

    • Mobile computing devices :

      Application processors are used in all mobile computers, such as tablets, PDAs, and ebook readers. Samsung's advanced processing and packaging technology for application processors can be used to improve and enhance the capabilities and performance of such applications.

    • Mobile communications devices :

      Application processors are used in all mobile computers, such as tablets, PDAs, and ebook readers. Samsung's advanced processing and packaging technology for application processors can be used to improve and enhance the capabilities and performance of such applications.

    • Entertainment/gaming devices :

      Today's high-end gaming devices require significant computing power, and most commonly use multi-core processors. Such applications stand to gain considerably by using Samsung's packaging technology for their multi-core application processors.

    • Consumer products :

      Product-specific application processors are used in a wide range of consumer electronic products, such as digital TVs and set-top boxes, DVD/Blu-ray players, and automobile navigation systems. The performance of such devices can be improved manifold by adopting Samsung's industry-leading packaging technology for application processors.

  • IMAGING SOLUTIONS

    IMAGING SOLUTIONS

    Overview

    An image sensor package is one of the most important components of any digital imaging device. It is a combination of an image sensor (such as a Charge Coupled Device or active-pixel sensor) mounted on an LGA (Land Grid Array) printed circuit board, held in place by a plastic holder, and covered by double-sided antireflective glass. This document describes the techniques for packaging such imaging devices, widely used in digital still/video cameras, digital camcorders, mobile cameras, and security cameras.

    figure 1 : An image sensor mounted on an LGA package and covered in a plastic case

    Packaging DRAM Memory

    As the imaging sensor is one of the principal components in any imaging or photography device, sufficient attention must be paid to its packaging, to ensure high-performance and reliable operation of the end application. Figure 1 illustrates how a typical image sensor is packaged, before it is deployed within the application.

    • mage sensor :

      Considered the heart of any imaging device, the image sensor captures incoming light, and converts it to electrical signals. These signals are processed further to obtain a pattern for the image falling on the sensor.

    • Copper-based LGA PCB :

      The LGA (Land Grid Array) package is one of the most preferred packages for deployment in small, handheld, and space-constrained applications. The LGA package is a version of the standard BGA package with no spheres (solder balls). The image sensor is mounted on the LGA PCB, providing the shortest interconnecting signal paths out of the sensor.

    • Plastic holder :

      The plastic holder provides a "frame” to hold the image sensor assembly in place.

    • Double-sided antireflective glass :

      The package is covered on top with double-sided antireflective glass to reduce reflection and improve image contrast.

      Samsung's advanced fabrication, processing, and packaging techniques for imaging sensors ensure that the sensors have excellent characteristics, such as low noise, high sensitivity, high resolution, wide spectral response, and high quantum efficiency (QE). Additionally, Samsung imaging device packages have exceptional thermal reliability.

    Key Features and Benefits of Samsung's Packaging Techniques for Imaging Devices

    Samsung's advanced packaging techniques for imaging devices provide the imaging sensors with some of the most distinct features, as listed below:

    • Ultra-low form-factors:

      Samsung's specialized processes encapsulate application processors in the smallest packages, achieving significant reductions in their physical sizes. This, in turn, reduces the board space occupied by the device in the final application. The process also ensures that the package profile (or height) is kept to as low a value as possible, making it easier to use the processor in compact, space-constrained applications such as digital still/video cameras and mobile handsets.

    • High thermal and transmission efficiencies:

      High-end embedded computing devices, such as network processors, usually contain more than 1 computing core per device (typically 3 to 4 cores per processor). Samsung's packaging technology is well suited for such high-speed, multi-core application processors, which involve extensive on-chip interconnection between the cores.

    • Available in industry-standard PLCC packages:

      Application processors usually contain a large number of I/O lines, resulting in the pin counts for the device reaching significantly high numbers (as high as 1,000 in certain cases). Using industry-standard alternative versions of the BGA package, such as FPBGA (Fine-Pitch Ball Grid Array), Samsung's refined processing techniques ensure reliability for all I/O lines on the chip.

    • Very high thermal stability and operational reliability:

      Samsung's advanced processes for packaging of imaging devices ensure consistent and reliable operation for the devices under extreme temperature conditions. Some of the distinct reliability related statistics for Samsung's unique processes are as follows:

      • Moisture sensitivity: JEDEC Level 4 (30°C/60%, 96 hours, IR 185°C (DSLR), ~260°C (DSC), 3 times)
      • WHTS test: 85°C, 85% relative humidity, 500 hours
      • Boundary temperature cycles: 200 cycles (-55~125°C)
      • High temperature storage test: 500 hours (125°C)

    Areas that can Benefit from Samsung's Packaging Technology for Application Processors

    As stated previously, imaging devices are used in a wide range of professional, medical, and scientific applications. Some of the principal areas that stand to benefit from using Samsung's advanced packaging techniques for imaging devices include:

    • Digital photography equipment:

      Devices such as digital still and video cameras stand to benefit significantly from using Samsung's high-end imaging sensors packaged using the most advanced packaging techniques available. Additionally, professional cameras, such as digital single-lens reflex (DSLR) cameras also stand to gain substantially from switching to Samsung's imaging devices. Samsung's imaging devices solutions range from variants below 1 MP, to sensors with resolutions as high as 16 Â MPs.

    • Mobile photography:

      Mobile cameras, along with webcams, most commonly use the active-pixel type of image sensors. Samsung is a leading provider of imaging solutions in this segment, and has a wide range of imaging devices to cater to the mobile telephony market.

    • Security photography:

      Samsung has a wide range of imaging devices for the security segment, including devices designed for deployment in infrared cameras.

  • DISPLAY DRIVER IC

    DISPLAY DRIVER IC

    Overview

    A display driver IC (DDI) is an integrated circuit designed to control the display subsystem in mobile phones, desktop and laptop computers, digital TV receivers, and external OLED (Organic Light-Emitting Diode) display panels, among others. This document describes the internal layout, advantages, and most common deployment areas for the most widely used packages for DDIs.

    figure 1 : A Tape Carrier Package (left) and a Chip In Film package (right) commonly used for DDis

    Packaging Display Driver ICs

    DDIs are most commonly supplied in two types of packages: TCP (Tape Carrier Package), and COF (Chip On Film). Figure 1 below illustrates both these packages, along with the layout of the driver IC within the package.

    TCP is a surface-mount technology providing multiple benefits, such as reduced pitch, thinner packages, and smaller footprints for the device on the PCB. TCP packages are capable of meeting a wide variety of designs and applications. Additionally, they also demonstrate excellent thermal stability.

    The COF package differs from TCP primarily in the way the IC is bonded to the base or substrate. COF packages offer certain significant advantages over TCP packages, such as the ability to make the device leads finer, making it possible to shrink the device further in size. Additionally, devices in COF packages maintain their reliability even under long term storage.

    Samsung's advanced manufacturing, processing, and packaging techniques ensure that DDIs supplied in both TCP and COF packages conform to the highest quality. Samsung is also a leader in the Tape Automated Bonding (TAB) packaging technology, which uses industry-standard Reel-to-Reel carrier tapes, facilitating easy, mass production of DDI devices.

    Key Features of the TCP and COF Packaging Techniques

    Samsung's TCP and COF packaging techniques for DDI devices provide several significant benefits to the end application, some of which are listed below :

    • Availability of high pin counts :

      Devices packaged in TCP or COF packages can provide high I/O pins, for applications which need them, such as display panels. This, in turn, provides higher flexibility for the DDI during its design phase.

    • Suitable form-factors compliant with a wide range of displays :

      Due to their small dimensions and low weights, both TCP and COF packages can be deployed in almost any device equipped with a display, from a mobile phone, to a digital TV receiver.

    • Excellent operational reliability :

      Samsung's TCP and COF packaging techniques provide excellent reliability for the device, as summarized by the following points:

      • Pressure cooker test : 96 or 168 hours (121°C, 100% relative humidity, 2.0 atm)
      • Boundary temperature cycles : 500 cycles (-55~125°C, no bias)
      • High temperature storage : 300 hours (150°C, no bias)
    • Halogen-free and environmentally-friendly composition :

      Samsung's TCP and COF packaging techniques use the latest, halogen-free manufacturing processes, making the material for the devices easier to recycle and reuse.

    Application Areas for Samsung TCP and COF Packages

    DDIs are used in almost all digital multimedia, entertainment, and computing devices, and Samsung's TCP and COF packaging solutions for DDIs are extensively used across all these segments. Some of the key application areas for Samsung's TCP and COF packages include :

    • Displays for computing devices :

      Desktop and laptop computer displays can benefit greatly from using Samsung's DDI device packaging solutions. As stated earlier, the primary advantages of Samsung's TCP and COF packages are high pin count availability, and low physical sizes and weights, making the devices ideal for deployment in the computing displays segment.

    • Displays for consumer products :

      Consumer electronic products, such as digital TV receivers, and external OLED (Organic Light-Emitting Diode) display panels can also benefit from the multiple advantages that Samsung DDI devices in TCP and COF packages have to offer.

  • SECURITY SOLUTIONS

    SECURITY SOLUTIONS

    Overview

    Security solutions is an area that has benefited significantly from advances in semiconductor packaging techniques. This document provides an overview of the most widely used packages for semiconductor devices used in security solutions.

    Packaging Techniques for Security Solutions Devices

    The latest security solutions devices are increasingly using NFC (Near Field Communication), a standard which allows wireless connection and data transfer between two devices in close physical proximity to each other (usually, a few centimeters). NFC has already been implemented in mobile phones, primarily to enable mobile handsets to act as payment gateways, e-tickets, and let the devices act as "electronic identity cards” (such as a medical ID card).

    Security solutions devices are most commonly offered in the FBGA (Fine-pitch Ball Grid Array) package, which offers multiple advantages, such as a thin and light structure, low profile (height), configurable ball pitch, and suitability for production on the mobile platform.

    Security solutions devices are primarily available in two variants: a standalone solution containing an application processor (AP) and the NFC controller, and a security-integrated solution containing an embedded security element (SE) in addition to the AP and NFC controller. Figure 1 below illustrates the standalone variant of a typical security solution in an industry-standard FBGA package.

    The second variant is a system-in-package solution containing a specific processor, such as a baseband/application processor, a DMB chip and other devices, as illustrated in Figure 2 below.

    Figure 2 : A security solution containing a security element (SE) along with the AP and NFC controller
    A security solution containing a security element (SE) along with the AP and NFC controller

    The system-in-package solution enables a reduction in the package footprint to a great extent, allowing mobile handsets to be designed with the smallest form factors. Samsung security packaging solutions are designed for the latest mobile communication devices containing the most advanced features, such as data encryption, along with high-density flash memory that provide sufficient capacity to store several details about the user. Packaging solutions provided by Samsung for security devices are preferred by designers and OEMs worldwide.

    Key Features and Benefits of Samsung's Packaging Techniques for Security Solutions Devices

    Samsung's packaging solutions for security devices have some of the most distinct features, making them ideal for packaging devices such as NFC controllers that are widely used in mobile handsets and other, similar devices utilizing the NFC protocol stack. Some of the most significant of these features are listed below:

    • Available in multiple combinations :

      Samsung provides packaging options for security solutions devices in the following combinations :

      • NFC + T-DMB + SE : The first combination provides an integrated solution with an NFC controller, a T-DMB (Terrestrial Digital Multimedia Broadcast) controller, and an SE (Security Element), all in the same package. Such a package is usually referred to as a system in package, or SIP.
      • NFC + CMMB + SE : The second combination provides a similar solution which combines an NFC controller and SE element with a CMMB (China Multimedia Mobile Broadcasting) standard content decoder. The CMMB standard applies to mobile television and multimedia signals specified and used in China.
    • Wide ball counts :

      Samsung's packaging techniques for security solutions offer wide ball counts, making it easy to provide high density devices with a large number of I/Os within small form factors. Ball counts are easily configurable, and can be taken to values as high as 600 in a single FBGA package.

    • Reliable thermal performance :

      Security solutions devices packaged using Samsung's advanced packaging techniques demonstrate excellent thermal stability, and offer reliable operation for the device, preventing conditions such as thermal runaways, and are capable of safely handling powers up to 2 W.

    • Available in lead- and halogen-free variants :

      Samsung's packaging techniques for security solutions use the latest, lead- and halogen-free manufacturing processes, making the material for the devices environmentally-friendly, and easier to recycle and reuse.

    • Excellent operational reliability :

      Samsung's security solutions packaging techniques provide significantly high reliability to the packaged device.

      • Moisture sensitivity characterization : JEDEC Level 3 (30°C/60%, 192 hours, IR 260°C, 3 times)
      • Highly Accelerated Stress Test (HAST) : 96 hours (130°C, 85% relative humidity)
      • Boundary temperature cycles : 500 cycles (-65~120°C)
      • High temperature storage : 500 hours at 150°C

    Application Areas for Samsung's Packaging Techniques for Security Solutions Devices

    Samsung's packaging solutions for security devices have some of the most distinct features, making them ideal for packaging devices such as NFC controllers that are widely used in mobile handsets and other, similar devices utilizing the NFC protocol stack. Some of the most significant of these features are listed below :

    • Accessing information on the move :

      Devices such as mobile handsets with NFC modules packaged using Samsung's advanced packaging technologies can be used to read smart posters and labels and other types of encoded, embedded digital content, making it easy to access information on-the-go.

    • Making mobile payments, and e-ticketing :

      NFC has been implemented in mobile phones primarily to enable mobile handsets to act as payment gateways, e-tickets, and let mobile devices act as "electronic identity cards” (such as a medical ID card). Samsung's high-quality packaging techniques ensure that such transactions are carried out conveniently and safely.

    • To transfer data between devices :

      Samsung's packaging techniques make it easy for two NFC devices to automatically initiate a network communication session without the need for any configuration, making it easy for the user to share content, such as audio, video, and image files.

    • As security devices :

      High quality NFC devices packaged using Samsung's packaging techniques can also be used as "smart keys” to access personal spaces.

    • In marketing (targeted advertising) :

      NFC devices packaged using Samsung's packaging techniques can be used for customer-centric marketing, using the principle of targeted advertising.