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how to submit
eligibility
A. Any undergraduate or graduate students enrolled in domestic or overseas universities who are capable
of writing a pure or applied technical thesis related to engineering (No restriction on majors; 2007
students also eligible)
B. Any paper that has not been published before December 3, 2007.
(only for technical thesis)
| applying fields | detailed fields | |
|---|---|---|
| Signal Processing | AV | Audio/Video/Image/Speech: Coding, Analysis, Retrieval, Computer Vision & Graphics |
| M/M Communication |
Streaming, Authentication & Watermarking | |
| M/M Systems | Architecture, Design & Tools | |
| NLP & Recognition |
Natual Language Processing, Pattern Recognition, Speech Recognition | |
| Procedssor Architecture |
DSP, Graphic Processor | |
| Analog Circuit Design |
RF | RF Amplifier, RF Filter, RF Oscillator |
| Circuit Design | Circuit Analysis & Synthesis, Circuit Theory | |
| Micro Design | Waveguide & Striplines, Microwave Circuit & Device | |
| Power Design | Power Semiconductor devices, Power Integrated Circuit | |
| Communication & Networks | "Transceiver Technologies" | Modulation, Demodulation, Channel Coding, Multiplexing, Multiple Access, Diversity, Signal Enhancement, Channel Model |
| Communication Protocols | Data Link Layer, Network Layer, Transport Layer, Application Layer | |
| Next Generation Systems |
Mobile Systems & Convergence Networks over All-IP | |
| Implementation | Communication Systems on Chip, Network/Communication Processor | |
| Computer Science & Computer Engineering | Computer Systems | Computer Architecture, Real-time/Embedded Systems, Parallel/Distributed Systems |
| Computer System Software | Operating Systems, Database Systems, (Web-based) Information Systems | |
| Theory & Modeling | Theory & Modeling: Algorithms, Security, Programming Languages/Compiler, Performance Evaluation & Modeling | |
| Computer Applications | Artificial Intelligence, Human Computer Interaction, Virtual Reality | |
| Others | Software Engineering, etc. | |
| Mechanical Engineering |
Control &Robotics | Control, Robots, Automation |
| Mechanical Analysis | Dynamics, Vibration, Acoustics, Fluid/Gas Dynamics, Thermodynamics, HVAC, etc. | |
| Mechanical Design | Mechanical Design, CAD/CAE/CAM, Optimization, etc. | |
| Solid Mechanics and Reliability | Solid Mechanics, Fracture Mechanics, Reliability, etc. | |
| Manufacturing Technology | Surface Mounting Technology, Metallic Moulding, Logistic Systems, Inspection, Manufacturing Equipments | |
| Material Science &Process | Advanced Materials | Metal,Ceramics, Polymer, Composite Material, Material Processing, Material Properties Electrical and Optica Material Analysis technology |
| Photo & Etch Process | Beam Technology, Lithography, Resist, and other Patterning Technology Plasma Ion and Dry Etch Process & Nanofabrication Technology. | |
| Cleaning & CMP Process | Chemical Mechanical Planarization, Cleaning Technology | |
| Thin Film Science & Process | Diffusion Process & Low-k /High-k Dielectric Film, Metallization Process Packaging Technology | |
| Surface Science & Process | Surface Treatment Process, Epitaxy, SOI, Shallow Junction Process | |
| Nano & Emerging Technology | Nano Particles and Molecule Technology Battery &Energy Technology | |
| Physical Devices | Si & Compound Semiconductor | including novel MOS devices, power devices, sensor |
| Nano Devices | including carbon nano devices, bio/molecular devices | |
| Display Devices | including LCD, PDP, Field Emission displays, organic/inorganic EL | |
| Optoelectronic Devices | including LED, lasers, etc. | |
| Physical Science (basic) | - | Physics, Mathematics, Environment, Chemistry |
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