Component |
Samsung Products |
Features |
Mobile processor |
ARM-based mobile SOCs |
Speeds: 400-667Mbps |
| Graphics DRAM |
GDDR4 |
Density: 512Mb
Speeds: 1100-1600MHz |
GDDR3 |
Densities: 256-512Mb
Speeds: 700-1000MHz |
GDDR2 |
Densities 256-512Mb
Speeds: 350-500MHz |
GDDR1 |
Densities 128-256Mb
Speeds: 200-250MHz |
RDRAM |
XDR RDRAM |
Densities: 256-512Mb Speeds: 2.4-4Gbps |
NAND Flash |
Discrete Components |
Densities: SLC: 256Mb-32Gb MLC: 8-64Gb |
OneNAND Flash fusion memory |
Densities: 256Mb-4Gb |
MMC cards – MMCplus, MMCmobile, MMCmicro, SecureMMC |
Densities: 64MB-2GB |
| MCP |
Multi-Chip Packages |
4-16 die per package Memories: NOR, NAND, OneNAND, mobile DRAM |
| ASIC |
Custom ASIC solutions |
Contact Samsung |
Samsung foundry |
Email foundry@ssi.samsung.com |
| HDD |
Hard disk drives |
3.5": 40-500GB capacity 2.5": 40-250GB capacity 1.8": 20-60GB capacity
|
| ODD |
CD/DVD-ROM; CD/DVD Writer |
Up to 8.5GB Interfaces: SATA, EIDE, ATAPI |
LCD |
Console LCD panels |
Standard: 15”, 17”, 19”, 20.1”, 21.3” Widescreen: 19”, 22”, 24”, 27”, 30” |
Mobile LCD panels |
Resolutions: 128x128 to 480x272 Sizes: 1.2-7 inches |
| Display driver ICs |
Panel DDI |
Resolutions: XGA, SXGA, SXGA-Plus, UXGA, WUXGA |
Mobile DDI |
Interfaces: CPU, RGB, VSYNCH |