Component |
Samsung Products |
Features |
Mobile processor |
ARM-based mobile SOCs |
Speeds: 400-667Mbps |
Mobile DRAM |
Mobile DDR components |
Densities: 128Mb-1Gb
Speeds: 133-183MHz |
| Mobile SDR components |
Densities: 64-1Gb
Speeds: 133-183MHz |
UtRAM |
UtRAM/UtRAM2 |
Density : 32Mb, 64Mb
Speed : 70ns, 104Mhz |
| NAND flash |
Discrete Components |
Densities: SLC: 256Mb-64Gb MLC: 8-64Gb |
SD and MicroSD Flash Cards |
Densities: 1GB-4GB |
| Fusion Memory |
OneNAND |
Densities: 256Mb-4Gb |
Flex-OneNAND |
8Gb |
OneDRAM |
512Mb |
moviNAND |
1Gb-16Gb |
| NOR flash |
NOR flash components |
Densities: 16-512Mb Speed: 70ns |
| MCP |
Multi-Chip Packages |
2-4 die per package
Memories: NOR, NAND, OneNAND, mobile DRAM |
| ASIC |
Custom ASIC solutions |
Contact Samsung: asic@ssi.samsung.com |
Samsung foundry |
Contact Samsung: foundry@ssi.samsung.com |
Image sensor |
CMOS image sensor components |
Resolutions: VGA, SXGA, UXGA, QXGA, QSXGA Sizes: 1/10 to 1/2.5 inch |
| LCD |
Mobile LCD panels |
Contact Samsung: lcd@ssi.samsung.com |
Mobile LCD ?dual-displays |
Contact Samsung: lcd@ssi.samsung.com |
| Display driver ICs |
Mobile DDI |
Interfaces: CPU, RGB, MIPI |