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Samsung Develops Advanced Technology to Produce 0.6mm-thick 8-chip Memory Package
Samsung has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB)densities, the new NAND flash chip package is just half the thickness of a conventional 8-stack memory package. The advanced packaging technology delivers a 40 percent thinner and lighter memory solution. Samsung's breakthrough technique for 15um-and-under chip thicknesses will allow for the design of very high density solutions with the smallest of form factors - an extremely attractive prospect for the highly competitive mobile market.
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SSDs Moving into the Mainstream as PCs Go 100% Solid State
This recently published article explains how 2009 is becoming a turning point for the adoption of SSDs. Now moving into the mainstream, these storage devices are outpacing predictions for adoption in notebooks and netbooks, while they are also being used in other applications such as servers, desktops and rugged industrial solutions. A combination of falling hardware costs and greater awareness of the advantages of SDDs over traditional storage - such as greater durability, more reliability, no noise and higher performance - is helping fuel the quick proliferation of SDDs.
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