April 23, 2003 in Social Responsibility News

SAMSUNG Announces Industry’s Highest Capacity Memory Modules for Intel Centrino Mobile Technology-based Notebooks

Seoul, Korea, April 23, 2003: Samsung Electronics Co., Ltd., the world’s leader in advanced semiconductor memory technology, today announced mass production of its 1GigaByte (GB) DDR266/DDR333 memory modules which are optimized for notebooks equipped with Intel® Centrino™ mobile technology. The new Small Outline Dual Inline Memory Modules (SODIMMs), consisting of 16 512Mb DDR chips configured in two rows, are half the size of an unbuffered DIMM (Dual Inline Memory Module) used in desktop PCs.

“High performance wireless notebook PCs require high density memory modules,” said Tom Quinn, vice president of U.S. memory sales and marketing. “With Samsung’s 512Mb DDR 266/333 devices in small form factor sTSOP packages, we are able to double system memory capacity and reduce space requirements.”

Representing Intel’s best technology for mobile PCs, Intel Centrino mobile technology includes a new mobile processor, related chipsets and 802.11 wireless network functions that have been optimized, tested and validated to work together. In addition to wireless communications, Intel Centrino mobile technology includes features designed to enable extended battery life, thinner and lighter notebook designs, and outstanding mobile performance.

The new modules, fabricated with 0.1-micron processing technology, feature 200 pins and measure 67.60mm wide by 31.75mm long by 3.80mm high. Samsung has developed a lightweight (0.28g) sTSOP (shrink Thin Small Outline Package) for SODIMMs that is only 134mm2 (11.76mm by 11.4mm). Half the size of conventional packages, the sTSOP uses a copper lead frame that suppresses heat generation during memory operation. This design is ideal for notebook PCs, which do not come with a heat-dispersing fan.


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