May 09, 2003 in Social Responsibility News

SAMSUNG Ramps Up Mass Production of NexMod Technology

Seoul, Korea – May 9, 2003: Samsung Electronics Co., Ltd., the world leader of advanced memory technology, today announced that its NexMod® technology is now available in mass production in memory configurations ranging from 128MB to 256MB using 288Mb-based RDRAM®.

Samsung’s NexMod™ memory module provides a small form factor module for high-performance RDRAM platforms and significantly reduces the footprint on the system motherboard for space-constrained networking systems. Many of these network systems being designed and deployed today are embracing network processor technology to provide high-performance, flexible and scalable architectures. Several network processors use RDRAM technology, including the Intel® IXP2800 network processor.

“Network system designers are looking for ways to add high-performance, high-density memory in a small form factor,” said Tom Quinn, vice president of U.S. memory sales and marketing. “The multi-tiered NexMod module, with a small footprint that measures 1.1 inches by 2.0 inches and is under 0.5 inches in height, offers all the circuitry for an entire Rambus channel in a single module.”

“Samsung’s decision to go into mass production with NexMod technology is very good for the high-performance networking market,” said Jim Finnegan, general manager, Intel Network Processor Division. “This will provide our IXP2800 customers with ample access to scalable, high-speed memory in a small footprint.” The memory channel can be constructed on one small PCB as an independent memory channel in a stacked configuration. RDRAM uses 30-40 percent fewer pins than other memory solutions and each pin operates at 1Gbps or faster. With an X18 architecture that supports ECC functions, the RDRAM memory channel elements can be configured in a straight line, which greatly enhances the flexibility of space utilization.

The electrical properties of NexMod ensure rapid signal transmission and the elimination of channel memory sockets to minimize the risk of signal disconnection. Conventional memory channels consist of a signal line and two memory sockets on the motherboard, whereas the single NexMod module decreases the channel length by 50 percent.

About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication and digital convergence technology. Samsung Electronics employs approximately 70,000 people in 87 offices in 47 countries. Samsung Electronics is the world’s leading producer of advanced semiconductors, TFT-LCDs, CDMA mobile phones, monitors and VCRs. Samsung Electronics consists of four main business units: Device Solution Network, Digital Media Network, Telecommunication Network and Digital Appliance Network Businesses.

The Device Solution Network specializes in semiconductor and TFT-LCD display products for industrial, mobile and advanced computing applications, offering a full line of key solutions of DRAMs, SRAMs, Display Driver ICs, Smart Card ICs, TFT-LCD panels and Flash memories. The Device Solution Network operates 11 overseas sales subsidiaries and mass production facilities to maximize on hand customer support. For more information, visit our website at

Samsung Semiconductor Inc., a wholly owned U.S. subsidiary of Samsung Electronics Co., Ltd., is located in San Jose, Calif. More information can be found at

Samsung Semiconductor Europe, a wholly owned subsidiary of Samsung Electronics Co., Ltd., is headquartered in Frankfurt, Germany and London, UK with sales offices all over Europe. More information can be found at

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Note to editors: NexMod is a registered trademark of High Connection Density, Inc. and RDRAM is a registered trademark of Rambus. All other trademarks that may be mentioned in this release are the intellectual property of their respective owners.

Intel and IXP are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

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