March 27, 2000 in Social Responsibility News

SAMSUNG Electronics Develops Worlds Smallest Package for SRAMs

The electronics industry is going digital and many small, easy-to-carry terminals have come on the market. This trend has heightened competition over technology to make semiconductor chips-a key component of portable products-lighter, thinner and smaller. Amid this backdrop, Samsung Electronics, the number 1 manufacturer of SRAMs in market share, has developed the world's smallest package for 8Mb SRAMs. The company applied tape ball grid array (TBGA) technology to the packages of its 8Mb SRAM. As a result, the device has a surface area of just 63mm2, only a quarter the size of conventional chips. The TBGA package uses a polymide tape rather than a printed circuit board between the chip and the connecting terminal (ball). The next-generation technology enables the package to be almost no bigger than the individual semiconductor wafer product. TBGA research is very active worldwide, and Samsung Electronics has become the first to apply this technology to an 8Mb device. SRAM memory chips are used mainly in wireless communication products, network hardware and desktop computers. In particular, they are ideal as the main memory for mobile phones because they consume very little power yet process data very quickly. By developing a very small SRAM package, Samsung Electronics will be able to accommodate the mobile phone market's demand for SRAMs with ever larger memory capacity in ever smaller packages. The company will ship the new device to major mobile phone manufacturers in Korea and overseas starting end of this year. According to the company, the 8Mb SRAM market will be US$300 million this year and double to US$600 million in 2001.


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