Since 2009, DS Division has been providing memory semiconductors and solutions designed to maximize energy efficiency every year. This has contributed to the reduction of greenhouse gas emissions generated by data centers as well as IT devices such as PCs and mobile devices. We have developed an LPDDR-based server module SOCAMM21) optimized for AI computing and are delivering optimal high-performance, low-power solutions tailored for the AI era through SSD products based on PCIe2) 5.0 with a 5nm controller.
The Exynos mobile processor integrates a wide range of functions, including a CPU (Central Processing Unit) and GPU (Graphics Processing Unit). It also features an NPU (Neural Processing Unit) and DSP (Digital Signal Processor) for AI, as well as a built-in modem for 5G connectivity, thereby improving power efficiency. Also, its powerful NPU delivers AI processing performance of 26 tera-operations-per-second (TOPS).
We are also working to reduce the power consumption of our customers' products by applying processes that enhance power efficiency, including the formation of fine patterns using EUV3) technology and the adoption of GAA4) transistors to stably lower operating voltages in ultra-fine circuits 3nm or smaller.
LPDDR (Low-Power Double Data Rate) DRAM incorporates advanced technologies such as EUV1), HKMG2), and F-DVFS3) to achieve faster speeds with lower power consumption.
Our lineup of PCIe5) 5.0-based SSDs with a 5nm controller offers optimal high-performance, low-power solutions for the AI era.
Mass production of next-generation mDDI products using 22nm process technology and low-power technologies and applications for foldable devices