Accelerating the tech frontier
From next-generation supercomputing to AI and graphic intensive technologies, the state-of-the-art 8 GB HBM2 Aquabolt from Samsung is high-bandwidth memory meticulously designed to dramatically increase performance and reduce power consumption from its predecessor HBM2 Flarebolt.
Layers of powerful performance
With just four Aquabolt packages in a system, performance can reach an astounding speed of 1.2 TB/s.
With the 20% performance improvement over legacy HBM2 product, Aquabolt delivers the highest 1024 I/O with 2.4 Gbps per pin speed
at 1.2V - making it the fastest data transmission speed for DRAM performance currently available from Samsung.
This powerful 307.2 GB/s data bandwidth allows for a nearly 10x faster data transmission than the 8 Gb GDDR5 chip.
-8 GB HBM2 package's data bandwidth:
2.4 Gbps per pin x 1024 bit bus = 307.2 GBps
4 HBM2 package in a system:
307.2 GBps x 4 = 1228.8 GBps = approximately 1.2 TBps
-8 Gb GDDR5 die's data bandwidth:
8 Gbps per pin x 32 bit bus = 32 GBps
Optimized power efficiency
Enhanced to conserve energy, the innovative Aquabolt internal design reduces write power consumption by approximately 20%, interleave power by about 25% and read power usage by nearly 30% when compared to the previous generation.*
To reinforce thermal control and endurance, each cube of Aquabolt includes more thermal bumps than the previous HBMs and a new protective bottom layer to safeguard against errors and data loss that can be caused by pressure, shock, and particles from direct contact.
All product specifications reflect internal test results and are subject to variations by user’s system configuration. All product images shown are for illustration purposes only and may not be an exact representation of the product. Samsung reserves the right to change product images and specifications at any time without notice.