Performance to power what’s next

Samsung’s HBM Flashbolt raises the bar for DRAM technologies, offering the performance required to transform what’s next into what’s now. Combining state-of-the-art TSV (through-silicon via) technology with high input/output density and superior bandwidth, HBM Flashbolt’s groundbreaking specs open the door for exciting advancements in next-generation technologies like AI, machine learning, high-performance computing and more.

Life in the

Taking technologies like supercomputers, graphics systems and AI to the next level will require DRAMs that are capable of supporting next-level speeds. Flashbolt has been engineered to foster fast data transfers of up to 3.2 Gbps per pin, making it approximately 33 percent faster than Samsung’s previous-generation High Bandwidth Memory (HBM) solution, HBM Aquabolt (2.4 Gbps).

An illustrative image of Samsung HBM Flashbolt's fast data transfers of 3.2 Gbps per pin.

Capacity to handle
what’s to come

Samsung equipped Flashbolt with the same advanced 8-layer TSV technology presented in previous HBMs, but doubled the capacity of its core dies – to a bar-raising 16 Gb. This means that Flashbolt offers twice the capacity of 8 Gb HBM Aquabolt, the previous generation HBM solution from Samsung.

An illustrative image of 16 Gb core dies that offers twice the capacity of 8 Gb HBM solutions on the market.

power supply


Flashbolt’s blazing speeds are complemented by exceptional power efficiency. Data transfers, while faster than those of Aquabolt, consume similar amounts of power. Power supply has also been enhanced thanks to an expanded* layout of power bumps that enables more power to be directed to the HBM’s interior.

*Compared to HBM Aquabolt

An illustrative image of Samsung HBM Flashbolt against an image of servers.

A streamlined design

Flashbolt’s 10 mm x 11 mm package design is squarer than that of its predecessor* and optimized to minimize warpage. This streamlined form factor boosts reliability in the long run by helping to reduce the chance of chips becoming loose and falling of the interposer

*Compared to HBM Aquabolt

An illustrative image of Samsung HBM Flashbolt's dimension 10x11 mm.

Related solutions

All product specifications reflect internal test results and are subject to variations by user’s system configuration. All product images shown are for illustration purposes only and may not be an exact representation of the product. Samsung reserves the right to change product images and specifications at any time without notice.