IoT
Exynos i T200
WiFi integrated IoT solution with enhanced performance and security
Exynos i T200 is Samsung’s WiFi-based integrated solution for Internet-of-Things (IoT) applications built on 28nm process technology. T200 features two high-performance MCU cores, on-chip security solution, and ancillary blocks.
Exynos i T200
Connectivity
Reliable wireless
connectivity with WiFi
Exynos i T200 has integrated baseband modem and RF transceivers for 802.11b/g/n single band and provides a reliable wireless connection as evidenced by WiFi Alliance certification. Exynos i T200 also integrates power amplifier, low-noise amplifier, and T/R switches for WiFi solution that benefits system’s bill-of-material.
Performance
Performance enhancement
with two MCU cores
Exynos i T200 has two MCU cores (Cortex-R4 and Cortex-M0+ core) for enhanced performance. For efficiency, different tasks can be assigned to different MCU for independent processing. For example, Cortex-M0+ can be used for I/O or LED control while CorteX-R4 controls system management. This eliminates the need for an addition microcontroller in the system in case there are workloads that can’t be effectively managed with a single microcontroller.
Security
On-chip security solution
for secure IoT system
To address growing concern around IoT security, Exynos i T200 has an on-chip ‘Security Sub-System’ dedicated to security management and a PUF (Physically Unclonable Functions), an on-chip IP which generates truly unique key for data encryption and device authentication. This security measure provides much higher level of security compared to the conventional OTP-based solution.
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CPU
Cortex®-R4 @ 320MHz,
Cortex®-M0+ @ 320MHz -
WiFi
802.11b/g/n Single band (2.4GHz) -
On-chip Memory
SRAM 1.4MB -
Interface
SDIO/ I2C/ SPI/ UART/ PWM/ I2S -
Front-end Module
Integrated T/R switch, Power Amplifier, Low Noise Amplifier -
Security
WEP 64/128, WPA, WPA2, AES, TKIP, WAPI, PUF (Physically Unclonable Function)
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All functionality, features, specifications and other product information provided in this document including, but not limited to, the benefits, components, performance, availability, and capabilities of the product are subject to change without notice or obligation.
