September 14, 1998 in Social Responsibility News

SAMSUNG Electronics Develops World's First Next-Generation Wafer Processing Technology

SEOUL, Korea - September, 14, 1998 - Samsung Electronics Co., Ltd., has completed development of a multi-layer circuit production process that uses Fully-Depleted-Silicon-On-Insulator (FD-SOI) elements, which involve wafer processing technology that can create next-generation, super-fast CPUs.

FD-SOI production technology is a core technology for reducing power consumption while improving signal transmission speed. Little additional design modification is required when designing devices using highly complex processing technology. A high degree of integration is possible, circuit design is easy and FD-SOI can be applied to existing products without having to make design changes. With SOI technology, chips can operate with a power supply of one volt only, facilitating the production of systems that are fast, energy-efficient and operable on low voltage. Chip size can be reduced and production processes simplified, which translate into lower production costs.

Moreover, Samsung Electronics has developed various cutting-edge processes to enhance speed and reduce power consumption. These include microscopic lithography, trench isolation, 4-nanometer-thick gate oxide film, low-resistance transistors, 4-layer and higher circuitry, and low-dielectric thin film.

FD-SOI can be applied to existing products without new investments in facilities. This means greater price competitiveness in the marketplace. Process technology for 0.25-micron circuitry is used, and CPUs with operating speeds of 1-gigahertz and higher can be produced. Chips made with FD-SOI operate 25% faster than other chips, so this technology can be applied to next-generation Alpha CPUs.

FD-SOI technology will also be applied to copper chips, which are scheduled for completion next year. This technological marriage is expected to result in chips that have 0.18-micron circuits and that operate at 1.5 gigahertz or higher.


Copper Chip:
Transistor connectors will be madet of copper instead of aluminum, increasing signal process speed while reducing production costs .

Microscopic Lithography:
A 0.25-micron krypton fluoride (KrF) laser is used to etch circuit patterns onto the wafer surface.

Trench Isolation:
Implementing electric circuits involves connecting isolated devices through specific conducting paths. Thus, to fabricate monolithic-silicon IC's, devices isolated from one another must be created in the silicon substrate. A variety of techniques have been developed to isolate devices in IC's. However, during this FD-SOI project, new trench isolation technology was developed for minimizing residual stress of SOI devices. Here, a trench isolation is first etched in the thin film Si on SOI, and refilled with an insulator material. Then the surface is planarized by a mechanical and chemical polishing process.

Low-Resistance Transistors:
A great deal of Samsung know-how has gone into transistor technology, a core part of the FD-SOI project. Samsung Electronics developed a super-thin cobalt silicide (conductor) film process to lower resistance of the transistor gate, source and drain. The process maximizes transistor performance.

4-Layer (or more) Circuitry:
Samsung Electronics has already secured the capability to make 4-layer circuitry, and the company expects to have circuitry of six layers or more by the time mass production begins. Currently, the company is applying its 0.25-micron design rule.

Low-Dielectric Thin Film:
The latest technology is applied to low-dielectric thin film, used as insulation between circuit layers.

In Samsung Electronics Co., Ltd., there are three main business units:
- Multimedia & Home Appliances
- Semiconductors
- Information & Telecommunications.

Samsung Electronics Co., Ltd., a US $13 billion (1997) flagship company of Korean-based Samsung Group, is a world leader in electronics, with operations in more than 60 countries and 85,000 employees worldwide.

Jenny Chung
Overseas PR
Corporate Communications
Samsung Electronics Co., Ltd.
Seoul HQ, Korea
Tel. 82-2-727-7692 / 7823 / 7821
Fax. 82-2-727-782

Welcome to Samsung

Sign up & get 10% off

Sign up and get 10% off your first order of $100 or more! Shop to find the best tech at the best prices and recieve news on our latest technology and exclusive offers.*

*Exclusion apply. Order must be a minimumm of $100 or more. Offer valid only for new customers. Must sign up for emails by 11/12/16. Promo code must be used by 11/19.

Fast, easy checkout with Shop Samsung App
Easy sign-in, Samsung Pay, notifications, and more!
Or continue shopping on
The Shop Samsung app
Free standard shipping, exclusive offers and financing options.
The Shop Samsung app
Free standard shipping, exclusive offers and financing options.

You Are About To Be Redirected To Investor Relations Information for U.S.

Thank you for visiting Samsung U.S. Investor Relations. You will be redirected via a new browser window to the Samsung Global website for U.S. investor relations information.

Redirect Notification

As of Nov. 1, 2017, the Samsung Electronics Co., Ltd. printer business and its related affiliates were transferred to HP Inc.

For more information, please visit HP's website:

Select CONTINUE to visit HP's website.