March 27, 2007 in Computing News

SAMSUNG Accelerates Evolution of the Mobile Era with Fusion Technology


Taipei, Taiwan - March 27, 2007: Samsung Electronics
Co., Ltd., the leader in advanced semiconductor technology, unveiled today
at the 2007 Samsung Mobile Solution Forum, held at the Westin Taipei Hotel,
new mobile technology solutions that are designed to accelerate the technological
evolution of mobile consumer electronics (CE).

The fourth annual event, hosted by Dr. Chang-Gyu Hwang, president of
Samsung Electronics’ Semiconductor Business, was attended by approximately
1,000 IT industry professionals including PDA, handset, and original CE
design manufacturers in Taiwan.


The main theme of the Samsung Mobile Solution Forum, designated as “Fusion
Magic” technology, was to provide designers with the flexibility to tune
new components to match the evolving features of mobile set applications
and as a result, deliver more cost-effective ways of providing much higher
performance. In all, five innovative mobile solutions were unveiled at
the Forum that are expected to lead future trends in the mobile industry
In his opening remarks, Dr. Hwang said, “Fusion Magic Technology, which
began with handsets, has rapidly spread throughout the mobile industry.
Our components are accelerating convergence, forming single-chip solutions
to enable lighter, smaller and slimmer applications.”


The line-up introduced at the forum includes a new fusion semiconductor
solution ? the Flex-OneNAND™; the industry’s first 1.8”-type 64Gigabyte
(GB) flash-based solid state drive (SSD); an innovative embedded application
processor solution with OneDRAMTM; the industry’s smallest 1.4㎛-pixel
format, 8.4 megapixel (Mp) CMOS image sensor (CIS); and an embedded 2.1”
quarter video graphics array (qVGA) TFT LCD with automatic light sensor.


Samsung underscored its Fusion Magic theme with the unveiling of Flex-OneNAND,
a complex memory solution employing both single-level cell (SLC) NAND
and multi-level cell (MLC) NAND. This new memory can be tuned from 2Gigabit
to 4Gigabit in a single core to support evolving CE applications.


It allows the flash solution to be controlled at any time during the
design/production cycle for each memory function within a multimedia device.


Another new solution exhibited at the Samsung Mobile Solution Forum was
a high-density 1.8”-type flash-SSD, incorporating an 8Gigabit SLC NAND
Flash.


By doubling the density and performance of last year’s 32GB SSD, the
64GB SSD provides the basis for SSDs to be adopted in the design of notebooks
as well as sub-notebooks. In addition, new prototypes of SSDs are being
tested in personal navigational systems and digital camcorders, as well
as in server applications.


Sales of SSDs are expected to grow from US$200million this year to US$6.8billion
in 2010, with SSDs becoming the mainstream application for NAND flash
memory over the next four to five years.


A new package on package (PoP) chip presented by Samsung’s System LSI
division at the Forum combines an application processor with a OneDRAM
memory chip to form another fusion semiconductor solution. This chip offers
a total solution for high-end mobile applications in such products as
3G and 3.5G smart phones, high-performance portable multimedia players
(with computing features), and portable navigation systems. By exhibiting
the PoP chip at the Forum, Samsung formally commenced a full-scale launching
of its fusion semiconductor business based on this first chip to combine
its System LSI Division’s world-class Mobile CPU with its Memory Division’s
proprietary OneDRAM fusion memory.


Another highlight at the forum was the unveiling of a new high-resolution
CMOS image sensor with the world’s smallest 1.4㎛pixel pitch and 8.4Mp
resolution for digital cameras and camcorders as well as mobile phones.


In addition, Samsung’s LCD Business introduced a 2.1” qVGA LCD panel
at the Forum with embedded auto-light sensing features for longer battery
life.


This application-oriented concept of fusing performance-enhancing functionalities
together is the underlying basis of Samsung’s ‘Fusion Semiconductor’ initiative.
This initiative, which began with the introduction of package-based solutions
of multi-chip packages (MCPs), package on package (PoPs) configurations,
and systems in packages (SIPs), was followed by a second generation of
integrated silicon solutions combining the functionality of individual
memory components with supporting software and logic (OneNAND).


The latest generation of fusion semiconductors is designed to marry two
or more fundamentally different memory functions within a single system.


Samsung’s new OneDRAM and Flex-OneNAND memory solutions are the first
examples of technologies embodying this third generation of fusion semiconductors,
and highlight the increasing role of semiconductor technology within the
system platform.


Samsung expects its fusion semiconductors to achieve US$10billion in accumulated
sales over the next five years (through 2011).



About Samsung Electronics

Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication,
digital media and digital convergence technologies with 2006 parent company
sales of US$63.4 billion and net income of US$8.5 billion. Employing approximately
138,000 people in 124 offices in 56 countries, the company consists of five
main business units: Digital Media Business, LCD Business, Semiconductor
Business, Telecommunication Network Business and Digital Appliance Business.
Recognized as one of the fastest growing global brands, Samsung Electronics
is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs.
For more information, please visit www.samsung.com.


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